There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

Preface to the Second Edition. Preface to the First Edition. 1 Introduction. 2 Network Analysis. 2.1 Network Variables. 2.2 Scattering Parameters. 2.3 Short-Circuit Admittance Parameters. 2.4 Open-Circuit Impedance Parameters. 2.5 ABCD Parameters. 2.6 Transmission-Line Networks. 2.7 Network Connections. 2.8 Network Parameter Conversions. 2.9 Symmetrical Network Analysis. 2.10 Multiport Networks. 2.11 Equivalent and Dual Network. 2.12 Multimode Networks. 3 Basic Concepts and Theories of Filters. 3.1 Transfer Functions. 3.2 Lowpass Prototype Filters and Elements. 3.3 Frequency and Element Transformations. 3.4 Immittance Inverters. 3.5 Richards' Transformation and Kuroda Identities. 3.6 Dissipation and Unloaded Quality Factor. 4 Transmission Lines and Components. 4.1 Microstrip Lines. 4.2 Coupled Lines. 4.3 Discontinuities and Components. 4.4 Other Types of Microstrip Lines. 4.5 Coplanar Waveguide (CPW). 4.6 Slotlines. 5 Lowpass and Bandpass Filters. 5.1 Lowpass Filters. 5.2 Bandpass Filters. 6 Highpass and Bandstop Filters. 6.1 Highpass Filters. 6.2 Bandstop Filters. 7 Coupled-Resonator Circuits. 7.1 General Coupling Matrix for Coupled-Resonator Filters. 7.2 General Theory of Couplings. 7.3 General Formulation for Extracting Coupling Coefficient k. 7.4 Formulation for Extracting External Quality Factor Qe. 7.5 Numerical Examples. 7.6 General Coupling Matrix Including Source and Load. 8 CAD for Low-Cost and High-Volume Production. 8.1 Computer-Aided Design (CAD) Tools. 8.2 Computer-Aided Analysis (CAA). 8.3 Filter Synthesis by Optimization. 8.4 CAD Examples. 9 Advanced RF/Microwave Filters. 9.1 Selective Filters with a Single Pair of Transmission Zeros. 9.2 Cascaded Quadruplet (CQ) Filters. 9.3 Trisection and Cascaded Trisection (CT) Filters. 9.4 Advanced Filters with Transmission-Line Inserted Inverters. 9.5 Linear-Phase Filters. 9.6 Extracted Pole Filters. 9.7 Canonical Filters. 9.8 Multiband Filters. 10 Compact Filters and Filter Miniaturization. 10.1 Miniature Open-Loop and Hairpin Resonator Filters. 10.2 Slow-Wave Resonator Filters. 10.3 Miniature Dual-Mode Resonator Filters. 10.4 Lumped-Element Filters. 10.5 Miniature Filters Using High Dielectric-Constant Substrates. 10.6 Multilayer Filters. 11 Superconducting Filters. 11.1 High-Temperature Superconducting (HTS) Materials. 11.2 HTS Filters for Mobile Communications. 11.3 HTS Filters for Satellite Communications. 11.4 HTS Filters for Radio Astronomy and Radar. 11.5 High-Power HTS Filters. 11.6 Cryogenic Package. 12 Ultra-Wideband (UWB) Filters. 12.1 UWB Filters with Short-Circuited Stubs. 12.2 UWB-Coupled Resonator Filters. 12.3 Quasilumped Element UWB Filters. 12.4 UWB Filters Using Cascaded Miniature High- And Lowpass Filters. 12.5 UWB Filters with Notch Band(s). 13 Tunable and Reconfigurable Filters. 13.1 Tunable Combline Filters. 13.2 Tunable Open-Loop Filters without Via-Hole Grounding. 13.3 Reconfigurable Dual-Mode Bandpass Filters. 13.4 Wideband Filters with Reconfigurable Bandwidth. 13.5 Reconfigurable UWB Filters. 13.6 RF MEMS Reconfigurable Filters. 13.7 Piezoelectric Transducer Tunable Filters. 13.8 Ferroelectric Tunable Filters. Appendix: Useful Constants and Data. A.1 Physical Constants. A.2 Conductivity of Metals at 25 C (298K). A.3 Electical Resistivity rho in 10-8 m of Metals. A.4 Properties of Dielectric Substrates. Index.

Microstrip filters for RF/microwave applications

In-band full-duplex (IBFD) operation has emerged as an attractive solution for increasing the throughput of wireless communication systems and networks. With IBFD, a wireless terminal is allowed to transmit and receive simultaneously in the same frequency band. This tutorial paper reviews the main concepts of IBFD wireless. One of the biggest practical impediments to IBFD operation is the presence of self-interference, i.e., the interference that the modem's transmitter causes to its own receiver. This tutorial surveys a wide range of IBFD self-interference mitigation techniques. Also discussed are numerous other research challenges and opportunities in the design and analysis of IBFD wireless systems.

/pdf/in-band-full-duplex-wireless-challenges-and-opportunities-djlyhtrciu.pdf

In-Band Full-Duplex Wireless: Challenges and Opportunities

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

http://science.sciencemag.org/content/sci/311/5758/208.full.pdf

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Fiber-based structures are highly desirable for wearable electronics that are expected to be light-weight, long-lasting, flexible, and conformable Many fibrous structures have been manufactured by well-established lost-effective textile processing technologies, normally at ambient conditions The advancement of nanotechnology has made it feasible to build electronic devices directly on the surface or inside of single fibers, which have typical thickness of several to tens microns However, imparting electronic functions to porous, highly deformable and three-dimensional fiber assemblies and maintaining them during wear represent great challenges from both views of fundamental understanding and practical implementation This article attempts to critically review the current state-of-arts with respect to materials, fabrication techniques, and structural design of devices as well as applications of the fiber-based wearable electronic products In addition, this review elaborates the performance requirements of the fiber-based wearable electronic products, especially regarding the correlation among materials, fiber/textile structures and electronic as well as mechanical functionalities of fiber-based electronic devices Finally, discussions will be presented regarding to limitations of current materials, fabrication techniques, devices concerning manufacturability and performance as well as scientific understanding that must be improved prior to their wide adoption

Fiber‐Based Wearable Electronics: A Review of Materials, Fabrication, Devices, and Applications

An anisotropic conductive adhesive (ACA) arrangement is disclosed, including a thermosetting resin disposed between a connector of a first structure and a connector of a second structure, and a plurality of ferromagnetic conductive particles dispersed through the thermosetting resin, wherein the plurality of ferromagnetic conductive particles form columns between the connector of the first structure and the connector of the second structure, and wherein a density of the ferromagnetic particles in the columns is substantially higher than a density of the plurality of ferromagnetic particles away from the columns

Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles

Thermoplastic co-extrusion was employed to fabricate an anisotropic dielectric composite based on titanium dioxide with a microcellular architecture with 50 μm macropore channels aligned to create unidirectional porosity. The resulting channeled structure exhibits artificial anisotropic dielectric properties, with the dielectric relative permittivity being 9.6 transverse to the channels and 90 in the longitudinal direction.

/pdf/fabrication-and-properties-of-an-anisotropic-tio2-dielectric-391q85ffoo.pdf

Fabrication and Properties of an Anisotropic TiO2 Dielectric Composite

Characteristics of z-axis interconnects using magnetically aligned anisotropic conductive adhesives (ACAs) are analyzed for their applicability for small pad sizes. In order to evaluate the performance of ACAs, a statistical estimation of the failure rate of interconnects was carried out using top-view images of assembled samples. Through a column mapping process, the failure rate is calculated as a function of pad size. The calculated and measured results indicate that the location of the formed columns is the predominant effect determining interconnect failure. The developed failure estimation approach is effective in demonstrating the effects of scaling to smaller particles in ACAs.

Analysis of Failure Rate by Column Distribution in Magnetically Aligned Anisotropic Conductive Adhesive

A 10-GHz filter/receiver module is implemented in a novel 3-D integration technique suitable for RF and microwave circuits. The receiver designed and fabricated in a commercial 0.18-mum CMOS process is integrated with embedded passive components fabricated on a high-resistivity Si substrate using a recently developed self-aligned wafer-level integration technology. Integration with the filter is achieved through bonding a high-Q evanescent-mode cavity filter onto the silicon wafer using screen printable conductive epoxy. With adjustment of the input matching of the receiver integrated circuit by the embedded passives fabricated on the Si substrate, the return loss, conversion gain, and noise figure of the front-end receiver are improved. At RF frequency of 10.3 GHz and with an IF frequency of 50 MHz, the integrated front-end system achieves a conversion gain of 19 dB, and an overall noise figure of 10 dB. A fully integrated filter/receiver on an Si substrate that operates at microwave frequencies is demonstrated.

/pdf/3-d-integration-of-10-ghz-filter-and-cmos-receiver-front-end-59x3x3uuep.pdf

3-D Integration of 10-GHz Filter and CMOS Receiver Front-End

In this paper, different densities within a ceramic are used to provide a wide, continuous range of cofirable dielectric constants for high frequency applications. Cofiring different ceramic materials together to make a single, unified structure to obtain different dielectric constant combinations is quite difficult due to phase stability issues and shrinkage mismatches. However, using various levels of porosity in order to alter the effective dielectric constant in the same material allows cofiring of different dielectric constants into a single unit. Since the structure is made from a single material, the varying porosities can be made compatible. Large scale aligned porosity using a microcellular structure allows for an extremely wide range of dielectric constants, ranging from 90 to 9.15, while maintaining a low loss tangent. Examples using the cofiring of the different density ceramics include a stratified medium cavity resonator and a buried dielectric resonator internal to a microcellular substrate.

William J. Chappell

Papers

Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles

Fabrication and Properties of an Anisotropic TiO2 Dielectric Composite

Analysis of Failure Rate by Column Distribution in Magnetically Aligned Anisotropic Conductive Adhesive

3-D Integration of 10-GHz Filter and CMOS Receiver Front-End

Variable dielectric constants by structured porosity for passive ceramic components