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Woon-Seong Kwon
Researcher at Xilinx
Publications - 29
Citations - 400
Woon-Seong Kwon is an academic researcher from Xilinx. The author has contributed to research in topics: Interposer & Flip chip. The author has an hindex of 11, co-authored 29 publications receiving 373 citations. Previous affiliations of Woon-Seong Kwon include Agency for Science, Technology and Research.
Papers
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Journal ArticleDOI
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
A. Heryanto,A. Heryanto,W. N. Putra,W. N. Putra,A. D. Trigg,S. Gao,Woon-Seong Kwon,Fa Xing Che,X. F. Ang,Jun Wei,Riko I Made,Chee Lip Gan,Kin Leong Pey,Kin Leong Pey +13 more
TL;DR: In this paper, the authors studied the phenomenon of Cu protrusion and microstructural changes during thermal annealing of a TSV wafer, and proposed a model to provide insight into the failure mechanism.
Journal ArticleDOI
Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology
Woon-Seong Kwon,Myongseob Kim,Jonathan Chang,Suresh Ramalingam,Liam Madden,Genie Tsai,Stephen Tseng,J. Y. Lai,Terren Lu,Steve Chiu +9 more
TL;DR: In this article, a 28nm FPGA with stacked silicon interconnect technology (SSIT) platform is used to develop and optimize the seamless integration of the processes, structures, parameter, as well as to evaluate the yield, reliability and device performance of them.
Journal ArticleDOI
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
Myung-Jin Yim,Jin-Sang Hwang,Jin-Gu Kim,Hyoung-Joon Kim,Woon-Seong Kwon,Kyung Woon Jang,Kyung-Wook Paik +6 more
TL;DR: In this paper, anisotropic conductive adhesives (ACA) with particular emphasis on the enhanced thermal conductivity of ACAs for flip chip applications were developed for flip-chip applications.
Journal ArticleDOI
Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)
Woon-Seong Kwon,Suresh Ramalingam,Xin Wu,Liam Madden,C. Y. Huang,Hung-Hsien Chang,Chi-Hsin Chiu,Steve Chiu,Stephen Chen +8 more
TL;DR: The stack silicon-less interconnect technology (SLIT) as mentioned in this paper provides the equivalent highbandwidth connectivity and routing design rule as stack silicon interconnect (SSI) technology at a cost-effective manner.
Journal ArticleDOI
Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications
TL;DR: In this paper, thermal cycling reliability of flip chip assembly using selected nonconductive pastes was verified and three candidates of NCPs with various silica filler and diluent contents were selected and used as adhesives for reliability test of flip-chip assemblies.