R
Riko I Made
Researcher at Singapore–MIT alliance
Publications - 35
Citations - 423
Riko I Made is an academic researcher from Singapore–MIT alliance. The author has contributed to research in topics: Thermocompression bonding & Contact resistance. The author has an hindex of 9, co-authored 34 publications receiving 364 citations. Previous affiliations of Riko I Made include Nanyang Technological University & Singapore Science Park.
Papers
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Journal ArticleDOI
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
A. Heryanto,A. Heryanto,W. N. Putra,W. N. Putra,A. D. Trigg,S. Gao,Woon-Seong Kwon,Fa Xing Che,X. F. Ang,Jun Wei,Riko I Made,Chee Lip Gan,Kin Leong Pey,Kin Leong Pey +13 more
TL;DR: In this paper, the authors studied the phenomenon of Cu protrusion and microstructural changes during thermal annealing of a TSV wafer, and proposed a model to provide insight into the failure mechanism.
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Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Riko I Made,Riko I Made,Riko I Made,Chee Lip Gan,Chee Lip Gan,Liling Yan,Aibin Yu,Seung Wook Yoon,John H. Lau,Chengkuo Lee,Chengkuo Lee +10 more
TL;DR: In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out, where the resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400°C.
Journal ArticleDOI
Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films
Chee Ying Khoo,Chee Ying Khoo,Hai Liu,W. A. Sasangka,Riko I Made,Nobu Tamura,Martin Kunz,Arief Suriadi Budiman,Chee Lip Gan,Chee Lip Gan,Carl V. Thompson,Carl V. Thompson +11 more
TL;DR: In this paper, the authors investigated the crystallization of GeTe films as a function of their deposition temperatures and deposition rates, using X-ray synchrotron radiation and Raman spectroscopy.
Journal ArticleDOI
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
Riko I Made,Riko I Made,Riko I Made,Chee Lip Gan,Chee Lip Gan,Li Ling Yan,Katherine Hwee Boon Kor,Hong Ling Chia,Kin Leong Pey,Kin Leong Pey,Carl V. Thompson,Carl V. Thompson +11 more
TL;DR: In this article, an analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal-metal thermocompression bonds, taking into account the pressure-dependent time evolution of the thermoco-compression bond formation.
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Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation
G. J. Syaranamual,G. J. Syaranamual,W. A. Sasangka,Riko I Made,Subramaniam Arulkumaran,Geok Ing Ng,Geok Ing Ng,S. C. Foo,Chee Lip Gan,Chee Lip Gan,Carl V. Thompson,Carl V. Thompson +11 more
TL;DR: It is proposed that in addition to causing joule heating, energetic electrons in the 2D electron gas contribute to device degradation by promoting electrochemical oxidation of the AlGaN.