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Xian Zeng
Researcher at Wuhan University of Technology
Publications - 2
Citations - 43
Xian Zeng is an academic researcher from Wuhan University of Technology. The author has contributed to research in topics: Ceramic & Ultrasonic soldering. The author has an hindex of 2, co-authored 2 publications receiving 32 citations.
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Journal ArticleDOI
Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.
TL;DR: Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder.
Journal ArticleDOI
Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves
TL;DR: In this article, an ultrasonic-assisted dipping of ZrO2 ceramics into molten Sn solder was performed to realize the low-temperature joining of ZRO2 poramics in this study, and the results showed that after ultrasonically dipping in molten Sn for 1200 seconds, a pure Sn solder layer with a thickness of approximately 8-9 µm was coated on the Zr O2 surface.