Li Liu

TL;DR: In this paper, the fracture characteristics of Cu6Sn5 and Cu3Sn micro beams under micro-cantilever bending tests were investigated. And the tensile fracture strength was estimated to be 1.13 ± 0.04 Pa and the average tensile strain was 0.01.

TL;DR: The feasibility of this setup for TM stressing was further verified with experimental and simulation methods; a temperature gradient in a solder seam was calculated as 1070 K/cm in this paper, and the microstructural evolution and mechanical properties of both plain and composite solder alloys were then studied under the condition of TM stressing.

TL;DR: In this paper, a ternary Ni-W-P alloy was prepared via electroless plating and its diffusion barrier property was evaluated by comparing the microstructures of IMC layers in Zn-5Al/Ni-Wp/P/Cu and Zn 5Al/Cu interconnects after liquid-solid reaction for prolonged durations.

TL;DR: In this article, the microstructure evolution, composition distribution, phase composition, melting characteristics, wettability and mechanical properties of the solder were studied, and compared to the cast-rolling Au-20Sn solder, the melting range was narrower, and the shear strength improved.

TL;DR: In this article, the effects of ultrasonic soldering time on the microstructure and mechanical properties of joints were investigated, and a pure Sn metallization layer which exhibited excellent metallurgic bonding with Al 2 O 3 ceramic was fabricated by ultrasonic dipping for more than 40 hours.