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Xianbao Shi

Researcher at University of Electronic Science and Technology of China

Publications -  35
Citations -  224

Xianbao Shi is an academic researcher from University of Electronic Science and Technology of China. The author has contributed to research in topics: Traveling-wave tube & Beam (structure). The author has an hindex of 8, co-authored 34 publications receiving 194 citations. Previous affiliations of Xianbao Shi include Buskerud and Vestfold University College.

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Study on Wideband Sheet Beam Traveling Wave Tube Based on Staggered Double Vane Slow Wave Structure

TL;DR: In this paper, a wideband 220 GHz sheet-beam traveling-wave tube (TWT) based on staggered double vane slow-wave structure (SWS) is investigated.
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Theoretical and Experimental Research on a Novel Small Tunable PCM System in Staggered Double Vane TWT

TL;DR: In this article, a small tunable periodic cusped magnet (NSTPCM) system is proposed for the purpose of realizing low voltage, big current sheet electron beam propagation in a long distance in engineering, which is composed of a series of position-fixed magnet blocks in alignment and freely sliding staggered pole pieces.
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Sheet Electron Beam Transport in a Metamaterial-Loaded Waveguide Under the Uniform Magnetic Focusing

TL;DR: In this article, the authors theoretically investigated the transport of a sheet electron beam focused by a uniform axial magnetic field in a metamaterial-loaded waveguide and proposed a theoretical model to analyze the beam transport.
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Study of High-Power Ka-Band Rectangular Double-Grating Sheet Beam BWO

TL;DR: In this article, a double-grating rectangular waveguide is used as the slow wave structure (SWS) for high power Ka-band electron beam backward wave oscillator, in which a high power sheet beam is used with a cross section of 30 mm.
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Improved Design and Microfabrication of ${H}$ -Plane and ${E}$ -Plane Loaded Rectangular Slow-Wave Structure for THz TWT Amplifier

TL;DR: In this paper, an improved input-output coupler is designed to enable easy fabrication by microfabrication technology, UV-lithography, electroplating and molding (LIGA), and deep reactive-ion etching.