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Showing papers by "Xianting Zeng published in 2002"


Journal ArticleDOI
TL;DR: In this paper, a bond-order-bond-length -bond strength correlation mechanism is presented for consistent insight into the origin of the shape and size dependence of a nanosolid, aiming to provide guidelines for designing nanomaterials with desired functions.
Abstract: A bond-order–bond-length–bond-strength (bond-OLS) correlation mechanism is presented for consistent insight into the origin of the shape-and-size dependence of a nanosolid, aiming to provide guidelines for designing nanomaterials with desired functions. It is proposed that the coordination number imperfection of an atom at a surface causes the remaining bonds of the lower-coordinated surface atom to relax spontaneously; as such, the bond energy rises (in absolute value). The bond energy rise contributes not only to the cohesive energy (ECoh) of the surface atom but also to the energy density in the relaxed region. ECoh relates to thermodynamic properties such as self-assembly, phase transition and thermal stability of a nanosolid. The binding energy density rise is responsible for the changes of the system Hamiltonian and related properties, such as the bandgap, core-level shift, phonon frequency and the dielectrics of a nanosolid of which the surface curvature and the portion of surface atoms vary with particle size. The bond-OLS premise, involving no assumptions or freely adjustable parameters, has led to consistency between predictions and experimental observations of a number of outstanding properties of nanosolids.

158 citations


Journal ArticleDOI
TL;DR: In this article, solid thin films are applied on test surfaces via unbalanced magnetron sputtering before polymer blocks are molded on and pulled apart using an Instron Machine to reduce the adhesion between polymer and mold steel of different surface roughness.
Abstract: In the plastic molding industry, plastic parts like pager and handphone cases, plastic containers, etc. are formed in a mold by applying temperature and pressure. The transfer molding is the standard workhorse for the electronics industry. Although the transfer molding is widely used, it is far from being optimized. Mold sticking is a serious practical problem in this industry. A solution to the problem is to apply mold-releasing agents on the mold to act as a lubricant layer between the plastic and the mold. This easily results in stains and degraded surface finish. This paper investigates the effectiveness of solid thin films on reducing the adhesion between polymer and mold steel of different surface roughness. WS2, MoS2, and DLC coatings are deposited on test surfaces via unbalanced magnetron sputtering before polymer blocks are molded on and pulled apart using an Instron Machine. The force required to separate the plastic part and the mold steel is used as an indication of the stickiness. After the separation, the coating surface is also examined under microscope for stains and polymer residues. The coatings are characterized using Raman spectroscopy and contact angle measurements. Generally, the stickiness increases with initial surface roughness for all coatings. Initial test indicates that the DLC coating has the highest contact angle with water (100°) and the best anti-sticking properties among the samples tested, and could reduce the stickiness by 80% as compared to bare steel.

28 citations