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Y. Liu

Researcher at Nanyang Technological University

Publications -  36
Citations -  372

Y. Liu is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Thin film & Ion implantation. The author has an hindex of 10, co-authored 31 publications receiving 358 citations. Previous affiliations of Y. Liu include University of Electronic Science and Technology of China.

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Batch normalization-free weight-binarized SNN based on hardware-saving IF neuron

TL;DR: Zhang et al. as discussed by the authors proposed a batch normalization (BN)-free weight binarized SNN based on hardware-saving IF neurons to reduce storage requirements and improve the computational efficiency of neuromorphic computing.
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Optical-Property Profiling of SiO2 Films Containing Si Nanocrystals Formed by Si+ Implantation

TL;DR: In this paper, a quantitative approach to determination of depth profiles of optical properties of Si-implanted SiO2 films based on spectroscopic ellipsometry (SE) was presented.
Proceedings ArticleDOI

Charging effect in germanium nanocrystals embedded in a SiO2 matrix

TL;DR: In this article, the effect of charging on the gate conduction in the gate stack of a Ge-nanocrystal-based NVM has been investigated and shown to have a significant impact on current conduction.
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Achieving High Core Neuron Density in a Neuromorphic Chip Through Trade-Off Among Area, Power Consumption, and Data Access Bandwidth.

TL;DR: In this article , an on-and off-chip co-design approach and a figure of merit (FOM) were proposed to achieve a tradeoff between chip area, power consumption, and data access bandwidth.
Proceedings ArticleDOI

A comparative study on the dielectric functions of isolated Si nanocrystals and densely stacked Si nanocrystal layer embedded in SiO2 synthesized with Si ion implantation

TL;DR: In this article, isolated Si nanocrystals (nc-Si) dispersedly distributed in a SiO 2 matrix and densely stacked nc-Si layers embedded in SiO2 have been synthesized with the ion implantation technique followed by high temperature annealing.