Yohannes M. Desta

TL;DR: In this paper, a high aspect ratio (HAR) metallic micromold insert was fabricated by the standard LIGA process using deep X-ray lithography (DXRL).

TL;DR: In this article, free-standing polymer sheets, perforated with a pattern of high-aspect-ratio throughholes, were clamped to conductive substrates to provide a template for electrodeposition of nickel microstructures onto the target surface.

TL;DR: In this paper, a procedure is described to fabricate a mold insert with tapered features having a height of approximately 1 mm and lateral dimensions of approximately 300 μm, which is used to injection mold tapered polymer high aspect ratio microstructures.

TL;DR: In this article, a new photoresist preparation method called "dry chip casting" was developed, which involves the reduction of the solvent content of a given photoreformer until the desired content is reached, the collection of the 'dry' chips and re-constitution on a substrate with the aid of heat and vacuum.

TL;DR: In this paper, a simple quasi-two-dimensional model is developed to qualitatively show that the adverse effects of diffusion of a cross-linking species can be significant also, experiments were performed to isolate the effects of parameters other than solvent content on performance (post exposure bake temperature, dose and top-to-bottom dose ratio, and feature height) These effects are placed in the context of the general hypothesis that preventing diffusion of cross-link species is a key to successfully defining ultra-tall, tightly packed SU-8 HARMs.