scispace - formally typeset
Z

Zhen Yao

Researcher at Harvard University

Publications -  16
Citations -  1522

Zhen Yao is an academic researcher from Harvard University. The author has contributed to research in topics: Thermal conductivity & Layer (electronics). The author has an hindex of 10, co-authored 14 publications receiving 1353 citations. Previous affiliations of Zhen Yao include University of Texas at Austin & University of California, Berkeley.

Papers
More filters
Journal ArticleDOI

Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device

TL;DR: In this paper, a microdevice consisting of two adjacent symmetric silicon nitride membranes suspended by long silicon-nitride beams for measuring thermophysical properties of one-dimensional manostructures (nanotubes, nanowires, and mmobelts) bridging the two membranes is fabricated.
Journal ArticleDOI

Thermal conductivity and phonon transport in suspended few-layer hexagonal boron nitride.

TL;DR: Thermal conductivities for both the 5-layer and the 11-layer samples are suppressed at low temperatures, suggesting increasing scattering of low frequency phonons in thin h-BN samples by polymer residue.
Journal ArticleDOI

Compound-Nucleus Decay along the Mass-Asymmetry Coordinate and the Role of the Businaro-Gallone Point

TL;DR: In this paper, the decay of compound nuclei (CN) produced in reactions of 74 and 84-MeV/nucleon was observed from the entire range of the mass-asymmetry coordinate.
Journal ArticleDOI

Effect of supporting layer on growth of carbon nanotubes by thermal chemical vapor deposition

TL;DR: In this article, a thin iron catalyst was used as a supporting layer on which a thin carbon nanotube was deposited, and cross-sectional transmission electron microscopy revealed a Stranski-Krastanov mode of iron island growth on tantalum.
Journal ArticleDOI

Large Reduction of Hot Spot Temperature in Graphene Electronic Devices with Heat-Spreading Hexagonal Boron Nitride.

TL;DR: Scanning thermal microscopy measurements reveal a significant thermal benefit of including a high thermal conductivity hexagonal boron nitride (h-BN) heat-spreading layer between graphene and either a SiO2/Si substrate or a 100 μm thick Corning flexible Willow glass (WG) substrate.