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Zhenlan Quan

Researcher at Shandong University

Publications -  8
Citations -  631

Zhenlan Quan is an academic researcher from Shandong University. The author has contributed to research in topics: Self-assembled monolayer & Corrosion. The author has an hindex of 6, co-authored 8 publications receiving 577 citations.

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The influence of hydrogen sulfide on corrosion of iron under different conditions

TL;DR: In this article, a probable reaction mechanism is proposed to interpret theoretically how hydrogen sulfide inhibits the corrosion of iron, which is attributed to formation of ferrous sulfide (FeS) protective film on the electrode surface.
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Adsorption behaviour of Schiff base and corrosion protection of resulting films to copper substrate

TL;DR: In this article, self-assembled (SA) films of Schiff base were prepared on the copper surface and the corrosion protection abilities of SA films in chloride solution were evaluated using electrochemical impedance spectroscopy and polarization curves.
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Protection of copper corrosion by modification of self-assembled films of Schiff bases with alkanethiol

TL;DR: In this paper, the corrosion protection of self-assembled films derived from Schiff bases, including N-2-hydroxyphenyl-(3methoxy-salicylidenimine) (V-bso), N 2 -hydroxymhenyl (S-Bso) and N,N′-o-phenylen-bis (S -S-O-ph-S), on copper surfaces have been probed by electrochemical techniques in an aqueous electrolyte.
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Self-Assembled Monolayers of Schiff Bases on Copper Surfaces

TL;DR: Self-assembled monolayers (SAM) of Schiff base N,N′-o-phenylen-bis(3-methoxysalicylaldenimine), designated as Vo-Ph-V, and N-2-hydroxyphenyl-(3mETHoxys alicylidenimine) designated asV-b... as mentioned in this paper.
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Factors Affecting the Quality and Corrosion Inhibition Ability of Self-Assembled Monolayers of a Schiff Base

TL;DR: In this article, self-assembled monolayers of a Schiff base were prepared on a copper surface under different conditions, and the quality and protection ability of resulting films against aqueous corrosion of copper were evaluated by alternating current (AC) impedance technique.