Conference
Japan International Electronic Manufacturing Technology Symposium
About: Japan International Electronic Manufacturing Technology Symposium is an academic conference. The conference publishes majorly in the area(s): Soldering & Electronic packaging. Over the lifetime, 169 publications have been published by the conference receiving 547 citations.
Topics: Soldering, Electronic packaging, Thin film, Reflow soldering, Ceramic
Papers
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04 Dec 1995
TL;DR: In this paper, the thermal, mechanical and vibration responses of flip chip and PBGA (Plastic Ball Grid Array) solder joints have been determined by bending and twisting experiments, and the effects of overload environmental stress factors on the mechanical responses of the solder joints were determined by out-plane vibration experiments.
Abstract: The thermal, mechanical and vibration responses of flip chip and PBGA (Plastic Ball Grid Array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping environmental stress factors on the vibration responses of the solder joints have been determined by out of plane vibration experiments. Also, the thermal fatigue behavior of solder joints have been investigated by nonlinear finite element, Coffin-Manson, and fracture mechanics methods.
41 citations
09 Jun 1993
TL;DR: In this paper, the stud-bump-bonding (SBB) technique was used for high density multi-chip-modules (MCM), which can bond bare LSI chips directly to a ceramic substrate.
Abstract: technique for high density Multi-Chip-Module (MCM), using called Stud-Bump-Bonding (SBB) technique, which can bond bare LSI chips directly to ceramic substrate. Au bump is formed on electrode pad of LSI chip by a wirebonding apparatus. Each Au bump has two-stepped construction and bonded with a conductive adhesive to an electrode terminal formed on the ceramic substrate. The conductive adhesive is very flexible and strong in bond, thus resisting thermal and mechanical stresses. Moreover, repair technique has been developed. 100 ,u m pitch electrode pads of LSI chip can be bonded to electrode terminals. The bonding resistance is less than 50 m i l . memory module. High density and reliability in bonding for MCM have been attained by the SBB technique. We have developed advanced flip-chip bonding We have applied the SBB technique to high density MCM for
31 citations
09 Jun 1993
TL;DR: In this paper, a simplified method of package cracking was proposed by introducing a material property for resin, which is the coefficient between the relative humidity of storage and the saturated moisture content, and the consequent process of package expansion during reflow soldering was measured.
Abstract: Plastic package cracking during reflow sol- dering is an important problem for the reliability of plas- tic encapsulated semiconductor devices This paper describes a simplified method of package cracking esti- mation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture content The consequent process of package expansion during reflow soldering was measured The individual pro- cesses were fitted by calculation and provided a pre- cise mechanism of package cracking
29 citations
09 Jun 1993
26 citations
04 Dec 1995
TL;DR: The assembly-plan-from-observation (APO) method as mentioned in this paper uses a human performing assembly operations in front of a TV camera to generate robot programs to repeat the same assembly operations.
Abstract: We have been developing a novel programming method, the assembly-plan-from-observation (APO) method. A human performs assembly operations in front of a TV camera. The APO system observes the human assembly actions, understands the actions, and generates robot programs to enable a robot arm to repeat the same assembly operations. This paper overviews our current activities on the APO project.
26 citations