IEEE Transactions on Component Parts 

About: IEEE Transactions on Component Parts is an academic journal. The journal publishes majorly in the area(s): Capacitor & Dielectric. It has an ISSN identifier of 0097-6601. Over the lifetime, 77 publications have been published receiving 449 citations.

Application of the Eyring Model to Capacitor Aging Data

Abstract: The Eyring Model has been used to derive the "power rule" for capacitors. Analytical models for evaluating progressive and step stress tests are presented. Various methods are discussed for determining the value of the exponent for the power rule. In particular, the relation between the exponent of the power rule and the \beta of the Weibull distribution, for both progressive and constant stress tests, is discussed. Data for mica capacitors are used to demonstrate the validity of these relations and to illustrate methods for determining the constants of the equations.

Processing Techniques and Applications of Positive Temperature Coefficient Thermistors

Abstract: Thermistors with positive temperature characteristics of resistance have been recently developed. Their distinguished temperature characteristics, being divided into two groups--type SW and TC--have various application fields in electronic and electrical engineering. The paper describes and surveys the processing techniques of major importance, the fundamental characteristics of this component, and design criteria for the desired component. Various uses of the component, as a thermal controller, a current limiter, a current stabilizer, a temperature compensator, etc., are explained to serve as a guide to other applications.

Inductor Size vs. Q: A Dimensional Analysis

Abstract: Equations are derived and curves are plotted showing the change in Q of an inductor as a function of a change in size. The approach used is to assume the existence of a model having a fixed inductance and operating under a fixed set of conditions. A change in size is introduced by a magnification-type enlargement or shrinkage of all outline dimensions by the factor "a." Assuming a constant effective permeability and readjusting the number of turns to maintain inductance constant results in the elimination of "n," the relative number of turns. With the further assumption of a constant copper space factor, the relative copper losses (in the absence of core losses) determine the relative Q as a function of relative size. Copper losses with skin effect and with solid conduction are considered. The same approach is used to derive equations of relative size vs relative Q for a pure core-loss inductor. For this purpose, core losses are approximated by a straight-line equation between the logarithm of flux density and the logarithm of core-loss density. This turns out to depend upon the properties of magnetic materials. Although under certain conditions core losses may actually go down as size goes down, the broader considerations (not treated mathematically in this paper) of combined copper and core losses make such a condition untenable. At least, the equations and curves can provide the basis for a judicious estimate of the effect of miniaturization on inductor Q in any specific application.

Switching in High Vacuum Enviroment

Abstract: An analysis is made of the properties and problems of Maximum current interrupting ability and photos of contacts contacts, switching, and holding off high and low voltages, high which are interrupting up to 18,000 a are shown. and low currents ac, dc, and RF in a high vacuum environment with some relation to outer space problems. Characteristics of contacts from above atmospheric pressure down to less than 10-9mm of mercury of pressure are listed in detail. Sparkover and spacing vs pressure (or vacuum) level, "cold" field emission currents vs spacing and voltage are graphed up to 200 kv. Change in vacuum levels vs time and arcing for sealed enclosures is listed showing average change from 10-9to 10-5mmHg taking 20 to 50 years under static conditions. Arc voltages in the order of twenty to one hundred volts for 1 to 18,000 a interruptions are shown. Switching recovery voltages and transient over-voltages from switching in vacuum are shown to be compatible with normal switching requirements, but awareness should be made of transient generating circuitry and mechanisms. A detailed analysis is shown in photographs of tungsten contacts after interrupting various high and low currents ac and dc. Examination shows that most high vacuum contact surface pitting, welding or projections are created by the "make" of current and the "break" or interruption of current results in only slight relatively smooth erosion or build up. In all cases with tungsten, the metal transfer is from the negative to the positive electrode, the same direction as electron flow.

Glass in Electronics

Abstract: While glass has many applications in the electronics means of "chemical machining" of photosensitive glasses. The field, five classifications serve to cover them all. The wide range of latter approach is widely applied to the making of printed wiring applications which exist is attributable to the wide range of properties boards. which can be obtained in glasses. Historically, the use of glass for its dielectric properties dates Sealability and impermeability of glasses have enabled them to back 200 years. The material is presently finding acceptance in maintain prominence in use for enclosures, starting with Edison's laminated capacitors where the end use demands utmost reliability. lamps and carrying through to today's electrostatic printing tubes. Glasses which can be sealed into laminated structures, then One recent sealing achievement was the simplification of color devitrified so as to develop ferroelectric properties, are now receiving television picture tube assembly by use of a relatively new material, attention. Devitrifying solder glass. Glass fibers as small as 8 microns in diameter are utilized in Structural and supporting parts may be made in intricate and various electronic and optical devices; cathode-ray tube trace complex shapes by means of the "multiform" process and by widths as small as 0.001 inch are obtainable by use of fibers in the tube faceplates. Bundles of fibers have been made to serve as signal pickoffs in certain ultrasonic delay line systems which take advantage of both the optical properties and some unusual acoustical properties of glass.