Journal of Electronics Manufacturing 

About: Journal of Electronics Manufacturing is an academic journal. The journal publishes majorly in the area(s): Printed circuit board & Solder paste. It has an ISSN identifier of 0960-3131. Over the lifetime, 210 publications have been published receiving 2808 citations.

Environmental concerns and recycling/disassembly efforts in the electronics industry

Abstract: This paper reviews the problems that many electronics manufacturers are facing in a society of rules and regulations that are becoming increasingly environmentally conscious. The effect of electronics assembly, disassembly, and disposal on the environment is reviewed, and the potential hazards of continuing the present trends in electronics parts disposal is discussed. The paper contains a comprehensive survey of previous works related to environmentally conscious manufacturing practices, recycling, and the complexities of disassembly in the electronics industry. Interest in this area has intensified in recent years due to an increased awareness of the problem in a world of high technology where electronic products dominate. Industrial applications of recycling programs are presented and existing methodologies and evaluation systems are discussed. In order to promote and support this new environmental ethic in electronics assembly and disassembly, the need for improved methods of electronics reuse, minimi...

A multi-criteria decision making approach for disassembly-to-order systems

Abstract: In this paper, we present a multi-criteria optimization model of a disassembly-to-order system to determine the best combination of the number of each product type to be taken back at the end-of-life and disassembled to meet the demand for items and materials retrieved from them under a variety of physical, financial and environmental constrains so as to achieve the preemptive goals of maximum total profit, maximum sales from materials, minimum number of disposed items, minimum number of stored items, minimum cost of disposal and minimum cost of preparation, in that order. When solved, the model provides the number of reused, recycled, stored and disposed items as well as the values of a host of other performance measures. A case example is presented to illustrate the model's implementation.

Analysis of design efficiency for the disassembly of modular electronic products

Abstract: In this paper, we present a technique for analyzing the design efficiency of electronic products, in order to study the effect of end-of-life (EOL) disassembly and disposal on the environment. The design efficiency is measured using a Design for Disassembly Index (DfDI). DfDI uses a disassembly tree (DT) which relies on the product's structure. The DT can be used to identify the precedent relationships that define the hierarchy of the product's structure (which in turn, represents the order in which components can be retrieved). DfDI can be used to analyze the merits and drawbacks of different product designs. The index offers designers with an important measure to help improve the future products. We provide a comprehensive procedure for developing the index and demonstrate its application through an example.

Analytical forced convection modeling of plate fin heat sinks

Abstract: An analytical model is presented that predicts the average heat transfer rate for forced convection, air cooled, plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, , and accurately predicts the experimental results to within an RMS difference of 2.1%.

Demand-driven disassembly optimization for electronic products

Abstract: In this paper, we address the problem of demand driven disassembly used to determine the optimal lot-sizes of end-of-life (EOL) products to disassemble so as to fulfil the demand of various components from a mix of different product types that have a number of components and / or modules in common. We discuss two approaches, viz., (1) the disassembly graph approach that is based on the study of the disassembly of mechanical products and (2) the component-disassembly optimization model that focuses on parts recovery by applying the reverse bill of materials. Although elegant, the main disadvantages of these two approaches are redundancy and nonlinearity respectively. To overcome these disadvantages, we propose a new method that combines the advantages of both approaches without their disadvantages. This is called the tree network model, which is a linear description of the demand driven, multiple product problem that includes commonality and multiplicity. Because of its simple structure, it can also be applied in dynamic situations, which is useful in problems that are related to production planning and inventory control in reverse logistics.