A compact LTCC-based Ku-band transmitter module
TLDR
In this paper, a 3D-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology is presented.Abstract:
Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded bandpass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage controlled oscillator (VCO) exhibits a measured up-conversion gain of 15 dB and an IIP3 of 15 dBm, while the power amplifier (PA) MMIC shows a measured gain of 31 dB and a 1-dB compression output power of 26 dBm at 14 GHz. Both MMICs were integrated on a compact LTCC module where an embedded front-end band pass filter (BPF) with a measured insertion loss of 3 dB at 14.25 GHz was integrated. The transmitter module is compact in size (400 /spl times/ 310 /spl times/ 35.2 mil/sup 3/), however it demonstrated an overall up-conversion gain of 41 dB, and available data rate of 32 Mbps with adjacent channel power ratio (ACPR) of 42 dB. These results suggest the feasibility of building highly SOP integrated RF front ends for microwave and millimeter wave applications.read more
Citations
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Journal ArticleDOI
Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology
Jong-Hoon Lee,G. DeJean,Saikat Sarkar,Stephane Pinel,Kyutae Lim,John Papapolymerou,J. Laskar,Manos M. Tentzeris +7 more
TL;DR: In this article, the authors demonstrate the development of advanced 3D low-temperature co-fired ceramic (LTCC) passive components for compact low-cost millimeter-wave wireless front-end modules.
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Package-level integrated antennas based on LTCC technology
Sang-Hyuk Wi,Yong-Bin Sun,In-Sang Song,Sung-Hoon Choa,Il-Suek Koh,Yongshik Lee,Jong-Gwan Yook +6 more
TL;DR: In this article, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process, and the antenna is mounted on a 20×20 mm2 ground plane to miniaturize the volume of the system.
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Low-loss LTCC cavity filters using system-on-package technology at 60 GHz
TL;DR: In this paper, a 3-dimensional (3-D) integrated cavity resonators and filters consisting of via walls are demonstrated as a system-on-package compact solution for RF front-end modules at 60 GHz using low-temperature co-fired ceramic (LTCC) technology.
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Synthetic quasi-TEM meandered transmission lines for compacted microwave integrated circuits
TL;DR: In this article, a two-dimensional transmission line (2-D TL) is proposed to support quasi-TEM propagation mode and reduces problems associated with compacted meandering of microstrip (MS) on propagation constants and the characteristic impedances commonly observed in conventional one-dimensional MSs.
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Design of an LTCC tri-band transceiver module for GPRS mobile applications
TL;DR: In this article, a low-temperature co-fired ceramic (LTCC) module for tri-band general packet radio service (GPRS) mobile applications is presented.
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