S
Saikat Sarkar
Researcher at Broadcom
Publications - 66
Citations - 1476
Saikat Sarkar is an academic researcher from Broadcom. The author has contributed to research in topics: CMOS & Amplifier. The author has an hindex of 17, co-authored 66 publications receiving 1361 citations. Previous affiliations of Saikat Sarkar include Avago Technologies & Georgia Tech Research Institute.
Papers
More filters
Journal ArticleDOI
20.2 A 16TX/16RX 60GHz 802.11ad chipset with single coaxial interface and polarization diversity
Michael Boers,Iason Vassiliou,Saikat Sarkar,Sean Nicolson,Ehsan Adabi,Bagher Afshar,Bevin Perumana,Theodoros Chalvatzis,S. Kavadias,P. Sen,Wei Liat Chan,Alvin Yu,Ali Parsa,Med Nariman,Seunghwan Yoon,Alfred Grau Besoli,Chryssoula A. Kyriazidou,Gerasimos Zochios,Namik Kocaman,Adesh Garg,Hans Eberhart,Phil Yang,Hongyu Xie,Hea Joung Kim,Alireza Tarighat,David Garrett,Andrew J. Blanksby,Mong Kuan Wong,Durai Pandian Thirupathi,Siukai Mak,Radha Srinivasan,Amir Ibrahim,Ersin Sengul,Vincent Roussel,Po-Chao Huang,Tsuifang Yeh,Murat Mese,Jesus Alfonso Castaneda,Brima Ibrahim,Tirdad Sowlati,Maryam Rofougaran,Ahmadreza Rofougaran +41 more
TL;DR: This paper presents a 802.11ad radio chipset capable of SC and OFDM modulation using a 16TX-16RX beamforming RF front-end, complete with an antenna array that supports polarization diversity.
Proceedings ArticleDOI
A 90nm CMOS 60GHz Radio
TL;DR: Proper transistor layout, complete and accurate modeling and optimized parasitic extraction method enabled the robust design of the wideband super-heterodyne architecture to support the entire 57- to-66GHz band.
Journal ArticleDOI
3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology
Manos M. Tentzeris,J. Laskar,John Papapolymerou,Stephane Pinel,V. Palazzari,RongLin Li,G. DeJean,N. Papageorgiou,D. Thompson,R. Bairavasubramanian,Saikat Sarkar,Jong-Hoon Lee +11 more
TL;DR: In this article, a 3D integration of RF and mm-wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and /spl mu/BGA technologies is presented.
Journal ArticleDOI
Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology
Jong-Hoon Lee,G. DeJean,Saikat Sarkar,Stephane Pinel,Kyutae Lim,John Papapolymerou,J. Laskar,Manos M. Tentzeris +7 more
TL;DR: In this article, the authors demonstrate the development of advanced 3D low-temperature co-fired ceramic (LTCC) passive components for compact low-cost millimeter-wave wireless front-end modules.
Journal ArticleDOI
A 60-GHz 144-Element Phased-Array Transceiver for Backhaul Application
Tirdad Sowlati,Saikat Sarkar,Bevin Perumana,Wei Liat Chan,Anna Papio Toda,Bagher Afshar,Michael Boers,Donghyup Shin,Tim R. Mercer,Wei-Hong Chen,Alfred Grau Besoli,Seunghwan Yoon,Sissy Kyriazidou,Phil Yang,Vipin Kumar Aggarwal,Nooshin Vakilian,Dmitriy Rozenblit,Masoud Kahrizi,Joy Zhang,Alan Wang,P. Sen,David Murphy,Ali Sajjadi,Alireza Tarighat Mehrabani,Evangelos Kornaros,Khim Leng Low,Koji Kimura,Vincent Roussel,Hongyu Xie,Kodavati Venkat +29 more
TL;DR: A 144-element phased array transceiver is realized using a modular tiled approach that supports 802.11ad, MCS12 single carrier 16-quadratic-amplitude modulation (QAM) 4.6 Gbps, in the 60-GHz band and has a measured over the air (OTA) max effective isotropic radiated power (EIRP) of 51 dBm at saturated power (PSAT).