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Journal ArticleDOI

An Evaluation of Materials and Processes for Integrated Microwave Circuits

F.Z. Keister
- 01 Jun 1968 - 
- Vol. 3, Iss: 2, pp 131-137
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TLDR
Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits and vacuum deposited chromium-gold thin film which was gold electroplated and photoetched to delineate the microwave pattern.
Abstract
This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz, and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold, and aluminum. Fabrication processes studied included vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing, and photoetching. Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were 1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; 2) thick-film silver which was photoetched to delineate the microwave pattern.

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References
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Proceedings ArticleDOI

Ceramic Microstrip For Microwave Hybrid Integrated Circuitry

B.T. Vincent
TL;DR: In this article, some of the characteristics of microstrip transmission lines on homogeneous ceramic dielectric substrates and on the two-dielectric substrate is discussed along with some examples of incorporating semiconductor devices with ceramic microstrip components to accomplish high performance microwave hybrid integrated circuitry.
Proceedings ArticleDOI

Integrated S band mixers

C. Genzabella, +1 more
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Microwave solid-state devices and circuits.

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