Book ChapterDOI
Cooling in Electronic Applications
Pradeep Lall
- pp 4-505-4-545
Reads0
Chats0
About:
The article was published on 1999-12-27. It has received 1 citations till now.read more
Citations
More filters
Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling : A Contribution to Physics of Failure in Reliability Prediction
TL;DR: In this paper, the authors discuss the challenges faced by manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems.
References
More filters
Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling : A Contribution to Physics of Failure in Reliability Prediction
TL;DR: In this paper, the authors discuss the challenges faced by manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems.