Patent
Copper electroplating apparatus
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TLDR
An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte, and preventing mixing thereof within a plating chamber as discussed by the authors.Abstract:
An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyteread more
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References
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Patent
Copper electroplating process
TL;DR: In this paper, a copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath.
Patent
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