Journal ArticleDOI
Electroless nickel–phosphorus plating on SiCp/Al composite from acid bath with nickel activation
Libo Li,Maozhong An +1 more
TLDR
An electroless Ni-P plating process on the surface of aluminum matrix composite reinforced with 70.vol.% SiC particles (SiC p /Al) has been investigated in order to improve its surface characteristics.About:
This article is published in Journal of Alloys and Compounds.The article was published on 2008-08-11. It has received 49 citations till now. The article focuses on the topics: Electroless nickel & Gold plating.read more
Citations
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Journal ArticleDOI
Electroless Nickel Plating – A Review
TL;DR: In this article, a review of the electroless nickel plating of mild steel is presented, focusing on the past and the present published research in this field, both past and present published literature information, both of the past literature information and current published research.
Journal ArticleDOI
Ni-P and Ni-Cu-P modified carbon catalysts for methanol electro-oxidation in KOH solution
R.M. Abdel Hameed,K.M. El-Khatib +1 more
TL;DR: In this paper, the electrocatalytic oxidation of methanol was studied on Ni-P and Ni-Cu-P supported over commercial carbon electrodes in 0.1 M KOH solution.
Journal ArticleDOI
Electromagnetic shielding and corrosion resistance of electroless Ni–P/Cu–Ni multilayer plated polyester fabric
TL;DR: In this article, the electroless Ni-P/Cu-Ni multilayers are electroless deposited onto polyester fabric as a function of the deposition time of Ni−P and compared with Ni·P and Cu−Ni deposits.
Journal ArticleDOI
Experimental study on the formation and growth of electroless nickel-boron coatings from borohydride-reduced bath on mild steel
TL;DR: In this paper, the growth and formation process of electroless nickel-boron was investigated by immersing mild steel (St-37) samples in an un-replenished bath for various periods of time (from 5 s to 1 h).
Journal ArticleDOI
Assembly of Ultra‐Thin NiO Layer Over Zn1−xCdxS for Stable Visible‐Light Photocatalytic Overall Water Splitting
TL;DR: A new Zn1-x Cdx S photocatalyst was developed for water splitting under visible-light illumination by assembling an ultrathin NiO layer over Zn0.8 Cd0.2 S through an in-situ photodeposition method and an apparent quantum efficiency of 0.66 % was achieved for hydrogen evolution at 430 nm.
References
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Journal ArticleDOI
Copper matrix SiC and Al2O3 particulate composites by powder metallurgy technique
TL;DR: In this article, a copper matrix reinforced with either Ni-coated or uncoated SiC and Al 2 O 3 particulate composites was made by means of the powder metallurgy route.
Journal ArticleDOI
Surface hydroxylation and local structure of NiO thin films formed on Ni(111)
TL;DR: In this paper, X-ray photon spectroscopy and low energy electron diffraction (LEED) were combined to study the surface hydroxylation and the structure of NiO thin films formed on NiO(111) at 300 and 500 K.
Journal ArticleDOI
The effect of interfacial modifying on the mechanical and wear properties of SiCp/Cu composites
Yongzhong Zhan,Guoding Zhang +1 more
TL;DR: In this paper, the results show that the densification, bulk hardness, ultimate flexural strength and ductility were improved by the electroless plating on the reinforcement, while the electrical conductivity remains at a fairly high level as the uncoated one.
Journal ArticleDOI
Polymer pretreatments for enhanced adhesion of metals deposited by the electroless process
M. Charbonnier,M. Romand +1 more
TL;DR: In this paper, X-ray photoelectron spectroscopy has allowed to monitor the chemical and compositional surface modifications of polymer substrates (polypropylene, polycarbonate) subjected to plasma and UV or VUV irradiation (use of ArF* excimer laser and Xe2* incoherent excimer lamp, respectively).
Journal ArticleDOI
The microstructure and the thermal expansion characteristics of Cu/SiCp composites
Kuen Ming Shu,G. C. Tu +1 more
TL;DR: In this article, the thermal expansion property of as-formed product was measured in the temperature range from 50 to 550 °C, which can be explained in terms of the residual stresses and the interfacial bonding between copper and silicon carbide.
Related Papers (5)
A new electroless nickel deposition technique to metallise SiCp/Al composites
Libo Li,Maozhong An,Gaohui Wu +2 more