Patent
Electroless palladium plating liquid, and three layer-plated film terminal formed using the same
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TLDR
In this paper, the problem of providing an electroless palladium plating liquid where a gold film is formed only by easily treatable substitution gold plating is solved, which has excellent joining strength in both of wire bonding joining and solder ball joining.Abstract:
PROBLEM TO BE SOLVED: To provide an electroless palladium plating liquid where, in a three layer plating film terminal of an electroless nickel plating film/ an electroless palladium plating film/a substitution gold plating film, a gold film is formed only by easily treatable substitution gold plating, and, even when electroless nickel-phosphorous having high flexibility is used, which has excellent joining strength in both of wire bonding joining and solder ball joining, and has excellent running properties as well. SOLUTION: The electroless palladium plating liquid at least comprises: a component (a): a palladium salt organic complex; a component (b): sulfide group-containing monocarboxylic acid or the salt thereof; and a component (c): hypophosphorous acid or the salt thereof. COPYRIGHT: (C)2007,JPO&INPITread more
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Patent
Electroless gold-plating method and electronic component
Masayuki Kiso,Seigo Kurosaka,Yukinori Oda,Toru Okada,Ayumi Okubo,阿弓 大久保,幸典 小田,亨 岡田,雅之 木曽,成吾 黒坂 +9 more
TL;DR: In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.
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Coating body and electronic component
TL;DR: In this paper, the authors proposed a coating body for a conductor 50 with a layered structure comprising a palladium layer 12 and an amorphous layer, which contained phosphorus in a concentration range of ≥7.3 to ≤ 11.0 mass%.
Patent
Process for producing connector and connector produced by the same process
TL;DR: In this paper, an object of the invention is to provide a process for providing a connector, which prevents component atoms constituting a material and a substrate layer from diffusing into a tin-containing material layer and suppressing an occurrence of external force-type whiskers upon the application of external forces to a surface of the tin containing material layer, and a connector produced by the same process.
Patent
Electroless palladium plating solution, and electroless palladium plated coating
TL;DR: In this paper, an electroless Pd plating solution was proposed, which enables formation of a Pd-plating film forming a plating film having excellent wire bondability even after high-temperature thermal history.