Patent
Heat dissipative integrated circuit chip package
TLDR
In this article, an integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a heat radiation plate and a heat sink rigidly mounted on the heat radiation cover.Abstract:
An integrated circuit chip package has a substrate, a plurality of integrated circuit chips, a plurality of heat radiation plates, a heat radiation cover, a heat sink rigidly mounted on the heat radiation cover and a plurality of terminals. The plurality of integrated circuit chips are each provided with a plurality of flexible beam leads on a body thereof and electrically and mechanically connected with the substrate via the beam lead. The heat radiation plates are each composed of a good thermal conductor and rigidly joined with the integrated circuit chips and a one-to-one correspondence by a first adhesive material. A radiation cover is also composed of a good thermo conductor and covers the chip mounting surface of the substrate and is held in contact with the heat radiation plates through a second adhesive material. The plurality of terminals are attached on a chip non-mounting surface of the substrate for input and output of signals to and from the chips and for supplying a voltage from the power source to the chips.read more
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Patent
Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
TL;DR: A thermally conductive plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion.
Patent
High performance integrated circuit chip package
Iwona Turlik,Arnold Reisman,Deepak Nayak,Lih-Tyng Hwang,Giora Dishon,Scott L. Jacobs,R. Darveaux,Neil M. Poley +7 more
TL;DR: In this article, a high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite side of the support substrate for connecting chips mounted thereon to one another and to the conductors.
Patent
Compliant fluidic coolant hat
TL;DR: A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs as mentioned in this paper, which can bend slightly to conform to a curved surface.
Patent
Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
TL;DR: In this paper, a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover are used to protect the chips from electrostatic discharges.
Patent
Convection transfer system
TL;DR: In this article, a convective transfer from a workpiece (10) to a flowing fluid (20) is presented, where the flow cross section and flow density facilitate heat transfer at a moderate flow rate and low fluid pressure.
References
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Patent
High performance semiconductor package assembly
TL;DR: In this article, a power supply distribution system for providing electrical supply voltages to the devices from the power connections consisting of radial waveguide structure including parallel waveguide planes with a low input impedence to reduce switching noise.
Patent
Integrated circuit chip package with improved cooling means
TL;DR: In this paper, an integrated circuit (IC) with flexible beam leads, the inner lead bonding sites of which are bonded to input and output terminals on the active face of the chip, is mounted active face down on the top surface of a substrate.
Patent
High-speed, high pin-out LSI chip package
TL;DR: In this article, a high-speed, high pin-out chip carrier package for interconnecting at least one LSI or VLSI chip to a circuit pack is disclosed.
Patent
Hermetic integrated circuit package for high density high power applications
TL;DR: In this article, the authors describe an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels, which enables the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream.
Patent
Cooling element for solder bonded semiconductor devices
TL;DR: An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on a substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being: a thermal bridge for conducting heat from the device to the cover which includes a relatively thick metal sheet provided with cuts that define at least 1 tab element, grooves in the tab element that make it bendable, and a spring means to selectively urge the tab elements into contact with the device as mentioned in this paper.