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High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials

TLDR
In this paper, the theory and practice of physical measurements by high-sensitivity moire - principally moire interferometry, focusing on the mechanics and micromechanics of materials and structural elements is discussed.
Abstract
Moire patterns (which form when two regular patterns of comparable frequency interfere) are sensitive indicators of changes of shape as objects rotate, heat up, or are otherwise affected by external forces Applications include non-destructive testing and evaluation, and quality and process control This text explains the theory and practice of physical measurements by high-sensitivity moire - principally moire interferometry, focusing on the mechanics and micromechanics of materials and structural elements Moire interferometry is unique in providing maps of in-plane displacements from which can be derived normal and shear strains Typical moire sensitivities are on the order of 2-4 fringes per fm displacement, but sensitivities of 17 nm per fringe contour can be reached The applications discussed include: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, and strain gage calibration The methods discussed in the text can be applied for whole-field measurements on nearly solid and solid bodies

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Journal ArticleDOI

The use of full-field measurement methods in composite material characterization: interest and limitations

TL;DR: An overview of the use of full-field measurement techniques for composite material and structure characterization reported in the recent literature is presented in this article, where the features of the main types of measurement techniques are first briefly described.
Book

Theory of the Moiré Phenomenon

TL;DR: Based on the Fourier theory the reader leads the reader through the various phenomena which occur in the superposition of repetitive layers, both in the image and in the spectral domains of the moire phenomenon.
Journal ArticleDOI

Characterization of hygroscopic swelling behavior of mold compounds and plastic packages

TL;DR: In this paper, the authors analyzed the hygroscopic swelling behavior of mold compounds by a novel experimental procedure using a whole-field displacement technique and found large variation in moisture content at the virtual equilibrium state.
Journal ArticleDOI

Packaging effects on reliability of Cu/low-k interconnects

TL;DR: In this paper, the chip-package interaction and its impact on low-k interconnect reliability was investigated and the results indicated that packaging assembly can significantly impact wafer-level reliability causing interfacial delamination to become a serious reliability concern for Cu/low-k structures.
Journal ArticleDOI

The Grid Method for In‐plane Displacement and Strain Measurement: A Review and Analysis

TL;DR: The grid method is a technique suitable for the measurement of in-plane displacement and strain components on specimens undergoing a small deformation as discussed by the authors, which relies on a regular marking of the surfaces under investigation.