Book ChapterDOI
II-4 – Planar Magnetron Sputtering
Robert K. Waits
- pp 131-173
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The article was published on 1978-01-01. It has received 21 citations till now. The article focuses on the topics: Sputtering.read more
Citations
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Journal ArticleDOI
Physics and technology of magnetron sputtering discharges
Journal ArticleDOI
Epitaxial crystal growth by sputter deposition: Applications to semiconductors. Part 2
TL;DR: The use of sputtered species as source material to deposit thin films was first reported in the literature in 18521 and has since enjoyed several periods of scientific and commercial interest interspersed with periods of disrepute as mentioned in this paper.
Journal ArticleDOI
Mass Spectrometric Investigations of Nano‐Size Cluster Ions Produced by High Pressure Magnetron Sputtering
Marina Ganeva,T. Peter,S. Bornholdt,Holger Kersten,Thomas Strunskus,Vladimir Zaporojtchenko,Franz Faupel,Rainer Hippler +7 more
TL;DR: In this paper, a comparison of quadrupole mass spectrometric (QMS) and transmission electron microscopic (TEM) characterization of silver nano-cluster deposition produced by a planar DC magnetron sputter source in a high pressure gas aggregation chamber is presented and discussed.
Journal ArticleDOI
Physical properties of a planar magnetron glow discharge
TL;DR: A planar magnetron glow discharge plasma device with permanent magnets located behind a planar cathode to trap plasma electrons in circular orbits parallel to the cathode surface is described in this paper.
References
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Journal ArticleDOI
Positive‐ion bombardment of substrates in rf diode glow discharge sputtering
J. W. Coburn,Eric Kay +1 more
TL;DR: In this article, the authors measured the potential of an electrically isolated surface in an rf diode sputtering glow discharge and investigated the influence on these potentials of both the geometry enclosing the discharge volume and of a positively biased auxiliary electrode in contact with the discharge.
Journal ArticleDOI
Permeation and Outgassing of Vacuum Materials
TL;DR: In this paper, a review of the literature dealing with the gas permeation characteristics of vacuum materials is presented, including alloys such as stainless steels and Kovar; pure metals such as copper, nickel, molybdenum, and tungsten; refractory oxides and ceramics; organic materials such as Viton, Teflon, and other elastomers; and laminated metal materials.
Journal ArticleDOI
A System for Determining the Mass and Energy of Particles Incident on a Substrate in a Planar Diode Sputtering System
TL;DR: In this paper, a bakable ultrahigh vacuum system has been constructed to sample the particle flux incident on the substrate of a planar diode sputtering system, where a beam of particles from the discharge is extracted into a long mean free path environment where it passes through a 90° deflection electrostatic analyzer into a quadrupole residual gas analyzer.
Journal ArticleDOI
Glow discharge sputtering
TL;DR: In this article, the authors describe the arrival at the substrate of a thin film and its formation and growth, including simple interfacial adhesion, interdiffusion between two materials, formation of intermediate layers and mechanical adhesion.
Journal ArticleDOI
Control of Film Properties by rf-Sputtering Techniques
TL;DR: The versatility of rf sputtering and related processes often allows one to tailor the properties of thin films in ways not always available with other methods of film deposition as discussed by the authors, and effects that occur at the target, in the gas discharge, and at the substrate are reviewed in the context of their over-all effect on the physical and chemical properties.