Proceedings ArticleDOI
Issues in validating package compact thermal models for natural convection cooled electronic systems
V. H. Adams,David L. Blackburn,Yogendra Joshi,D.W. Berning +3 more
- Vol. 20, Iss: 4, pp 10-23
TLDR
The study shows that the system must be well characterized, including accurate knowledge of circuit board thermal conductivity and accurate simulation of radiation heat transfer, to serve for validation purposes and the JEDEC enclosure can serve as a viable experimental validation tool for compact models.Abstract:
A methodology is proposed for the validation of compact thermal models of electronic packages which utilizes data and simulations obtained from a simple but realistic system containing the package. The test system used to demonstrate the methodology is the enclosure specified by the Electronic Industries Association JEDEC Subcommittee JC15.1 for thermal measurements in a natural convection environment. Simulations for a detailed model and several different compact models for a 88-pin plastic quad flat-package in the enclosure are in good agreement with experimental measurements of junction temperature. The study shows that the system must be well characterized, including accurate knowledge of circuit board thermal conductivity and accurate simulation of radiation heat transfer, to serve for validation purposes. For the package used in this study, system level considerations can outweigh package level considerations for predicting junction temperature. Given that the system is accurately modeled, the JEDEC enclosure can serve as a viable experimental validation tool for compact models.read more
Citations
More filters
Journal ArticleDOI
Thermal component model for electrothermal analysis of IGBT module systems
TL;DR: In this article, the static and dynamic thermal behavior of IGBT module system mounted on a water-cooled heat sink is analyzed using an RC component model (RCCM) to extract thermal resistances and time constants.
Journal ArticleDOI
The world of thermal characterization according to DELPHI-Part I: Background to DELPHI
TL;DR: The DELPHI project as mentioned in this paper was concerned with the creation and experimental validation of thermal models (both detailed and compact) of a range of electronic parts, including mono-chip packages, heat sinks, electrolytic capacitors, transformers, and interfacing materials.
Journal ArticleDOI
The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods
TL;DR: The DELPHI survey as discussed by the authors describes the experimental methods that have been developed to validate the numerical models generated to characterize a certain electronic part in full detail and highlights the various approaches that were studied to generate compact models from the detailed models.
Journal ArticleDOI
Compact models for accurate thermal characterization of electronic parts
H. Vinke,C.J.M. Lasance +1 more
TL;DR: It is found that the compact models values typically approach the full model values within 6%.
Journal ArticleDOI
A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer
TL;DR: Rodgers et al. as discussed by the authors evaluated the predictive accuracy of a commercial CFD code for both natural and forced convection heat transfer of single and multicomponent printed circuit boards (PCBs).
References
More filters
Book
Numerical heat transfer and fluid flow
TL;DR: In this article, the authors focus on heat and mass transfer, fluid flow, chemical reaction, and other related processes that occur in engineering equipment, the natural environment, and living organisms.
Journal ArticleDOI
Thermal characterization of electronic devices with boundary condition independent compact models
TL;DR: A novel approach is introduced, based on the derivation of a simple resistance network starting from a detailed model, using optimization techniques, and it is demonstrated that it is possible to create a compact model comprising asimple resistance network, representing the detailed model to a high accuracy, which is independent of the boundary conditions.
Journal ArticleDOI
Mirage-effect measurement of thermal diffusivity. Part II: theory
TL;DR: In this article, a three-dimensional theory of a mirage effect technique for measuring thermal diffusivity of solids is presented, incorporating sizes and separations of the heating and probe beams.