Journal ArticleDOI
MgSiN2 Addition as a Means of Increasing the Thermal Conductivity of β‐Silicon Nitride
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TLDR
In this paper, the thermal conductivity of Si3N4 powders with the concurrent addition of Yb2O3 and MgSiN2 were sintered at 1900°C for 2-48 h under 0.9 MPa nitrogen pressure.Abstract:
Si3N4 powders with the concurrent addition of Yb2O3 and MgSiN2 were sintered at 1900°C for 2–48 h under 0.9 MPa nitrogen pressure. Microstructure, lattice oxygen content, and thermal conductivity of the sintered specimens were evaluated and compared with Si3N4, Yb2O3, and MgO addition. MgSiN2 addition was effective for improving the thermal conductivity of Si3N4 ceramics, and a material with high thermal conductivity over 140 W·(m·K)−1 could be obtained. For both specimens, lattice oxygen content was decreased with sintering time. However, the thermal conductivity of the MgSiN2-doped specimen was slightly higher than the MgO-doped specimen with the same oxygen content.read more
Citations
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Journal ArticleDOI
Textured silicon nitride: processing and anisotropic properties
Xinwen Zhu,Yoshio Sakka +1 more
TL;DR: Various anisotropic properties of textured Si3 N4 and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact damage behavior and thermal conductivity.
Journal ArticleDOI
Development of high-thermal-conductivity silicon nitride ceramics
TL;DR: In this paper, the authors give an overview on recent development of Si3N4 substrate materials for the next-generation power devices, and present an overview of the most promising substrate materials.
Journal ArticleDOI
Processing and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride. I: Effect of Si Powder Characteristics
TL;DR: In this article, a sintered reaction-bonded silicon nitride (SRBSN) material with a high thermal conductivity of 121 W·(m·K) -1, which has been successfully prepared from a coarse Si powder with lower levels of oxygen and aluminum impurities, using a mixture of Y 2 O 3 and MgSiN 2 as sintering additives, by nitriding at 1400°C for 8 h and subsequent post-sintering at 1900°c for 12 h at a nitrogen pressure of 1 MPa N 2
Journal ArticleDOI
Redox Targeting of Insulating Electrode Materials: A New Approach to High-Energy-Density Batteries†
TL;DR: This poster presents a probabilistic procedure to constrain the number of particles in the response of the immune system to the presence of Tau.
Journal ArticleDOI
Phase stability, mechanical and thermodynamic properties of orthorhombic and trigonal MgSiN2: an ab initio study
TL;DR: In this paper, structural stability and mechanical and thermodynamic properties of the orthorhombic and trigonal MgSiN2 polymorphs were investigated through density functional theory and quasi-harmonic Debye model (QHDM).
References
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Journal ArticleDOI
Thermal Conductivity of β‐Si3N4: II, Effect of Lattice Oxygen
TL;DR: In this paper, the relationship between the microstructure, grain-boundary phase, lattice oxygen content, and thermal conductivity of β-Si3N4 that was sintered at various Y2O3/SiO2 additive ratios has been clarified.
Journal ArticleDOI
Thermal Conductivity of ß-Si3N4: I, Effects of Various Microstructural Factors
TL;DR: In this article, a simple modified Wiener's model for thermal conductivity of a composite material was used to predict that the thermal conductivities of β-Si 3 N 4 decreases quickly as the grain-boundary film thickness increases within a range of a few tenths of a nanometer.
Journal ArticleDOI
High Thermal Conductivity in Silicon Nitride with Anisotropie Microstructure
TL;DR: In this paper, a tape casting of {alpha}-Si{sub 3}N{sub 4} powder with 5 wt% Y{sub 2}O{sub3} and 5 vol% rod-like seed particles is described.
Journal ArticleDOI
Thermal Conductivity of β‐Si3N4: III, Effect of Rare‐Earth (RE = La, Nd, Gd, Y, Yb, and Sc) Oxide Additives
TL;DR: In this paper, β-Si 3 N 4 ceramics sintered with a series of rare-earth (RE = La, Nd, Gd, Y, Yb and Sc) oxide additives were fabricated by hot pressing and subsequent annealing.
Journal ArticleDOI
Thermal conductivity of gas-pressure-sintered silicon nitride
TL;DR: Si{sub 3}N{sub 4} with high thermal conductivity was developed by promoting grain growth and selecting a suitable additive system in terms of composition and amount as mentioned in this paper.
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