Journal ArticleDOI
Parametric Optimization for Photochemical Machining of Copper using Overall Evaluation Criteria
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TLDR
In this article, the effect of process parameters on output parameters has been studied using Analysis of Variance (ANOVA) and overall evaluation criteria (OEC) have been formulated by assigning equal weight percentage to MRR and ED.About:
This article is published in Materials Today: Proceedings.The article was published on 2018-01-01. It has received 33 citations till now. The article focuses on the topics: Photochemical machining & Taguchi methods.read more
Citations
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Journal ArticleDOI
Numerical and experimental investigations on the performance of a serpentine microchannel with semicircular obstacles
TL;DR: In this article, the authors focus on computational and experimental analysis of a simple serpentine microchannel without obstacles and an SMC with semicircular obstacles of different sizes, and the effect of obstacle size on pressure drop and mixing length for achieving index 1 is analyzed.
Book ChapterDOI
Photochemical Machining: A Less Explored Non-Conventional Machining Process
TL;DR: In this article, the history and development of photochemical machining in brief are discussed followed by gaps identified along with scope for the work and then the PCM process is explained in detail.
Journal ArticleDOI
A novel passive micromixer with array of Koch fractal obstacles in microchannel
TL;DR: In this article, six passive micromixer models with co-later co-lating are presented. But the authors focus on the mixing efficiency of these models and do not discuss their performance.
Book ChapterDOI
Influence of Confluence Angle Between Inlets on the Mixing Performance of Micro-mixer with Obstacles
TL;DR: In this article, the effect of confluence angle between two inlets on the mixing performance and pressure drop characteristics for flow in straight micro mixer with obstacles along the channel width was analyzed.
Journal ArticleDOI
Investigation on surface integrity of Co-Cr L605 alloy in photochemical machining
TL;DR: In this article, the surface integrity of Co-Cr L605 using photochemical machining was investigated, focusing mainly on the effects of different manufacturing processes, such as forging, wire-EDM, and rolling, on the metallurgical parameters of co-cr L605 in PCM.
References
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Book
Design of Experiments Using The Taguchi Approach: 16 Steps to Product and Process Improvement
TL;DR: In this article, the authors define and measure quality common experiments and methods of analyses experiment designs using orthogonal arrays experiments with 2-level factors only experiments with 3-level and 4level factors analysis of variance (ANOVA) experiments to study interactions between factors experiments design with mixed level factors combination designs strategies for robust design analysis using signal to noise ratios(S/N) results comprising of multiple criteria of evaluations quantification of variation reduction and performance improvement effective experiment preparation and planning example case studies.
Journal ArticleDOI
Copper etching with cupric chloride and regeneration of waste etchant
TL;DR: In this paper, the effect of etchant concentration, additives and etching temperature on the etch rate of copper etching process with cupric chloride etchant was investigated, based on the various effects on etch speed.
Journal ArticleDOI
Parametric Optimization for Selective Surface Modification in EDM Using Taguchi Analysis
TL;DR: In this article, a hard layer of tungsten and copper mixture is created at selected area of aluminum surface using W-Cu powder metallurgical green compact tool and masking technique in die-sinking electric discharge machining.
Journal ArticleDOI
Chemical etching of aluminium
TL;DR: In this paper, the effects of selected chemical etching parameters on depth of etch and surface finish quality were investigated and it was observed that FeCl3 was very useful chemical etch for aluminium etching.
Journal ArticleDOI
Chemical etching of Cu-ETP copper
Orhan Çakır,H. Temel,Murat Kiyak +2 more
TL;DR: In this article, the effects of selected etchants and machining conditions on the depth of etch and surface roughness were investigated, and the experimental study provided that ferric chloride produced the fastest chemical etch rate, but cupric chloride provided the smoothest surface quality.