Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TLDR
A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.About:
This article is published in Microelectronics Journal.The article was published on 2003-03-01. It has received 340 citations till now. The article focuses on the topics: Thermal grease & Interface (computing).read more
Citations
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Journal ArticleDOI
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
TL;DR: The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use and merits and demerits of using nanoparticles and nanotubes for TIM applications.
Journal ArticleDOI
Aligned Carbon Nanotube Composite Films for Thermal Management
Journal ArticleDOI
Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes
TL;DR: In this paper, the effect of Al2O3 or ZnO fillers on the thermal conductivity and coefficient of thermal expansion (CTE) of the silicone rubber was investigated.
Journal ArticleDOI
Thermal properties of the hybrid graphene-metal nano-micro-composites: Applications in thermal interface materials
TL;DR: In this paper, the authors report on synthesis and thermal properties of the electrically conductive thermal interface materials with the hybrid graphene-metal particle fillers and show that the thermal conductivity of resulting composites was increased by ∼500% in a temperature range from 300 to 400 k at a small graphene loading fraction of 5-vol.-%.
Journal ArticleDOI
Properties of thermally conductive micro and nano size boron nitride reinforced silicon rubber composites
TL;DR: In this paper, the effects of loading level of micro or nano size BN particles on the thermal, mechanical, and morphological properties of silicone rubber are investigated, and five types of BNs are found to be well-dispersed in silicone rubber matrix despite some local agglomerates.
References
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Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Patent
Thermal interface materials
TL;DR: In this article, a crosslinkable thermal interface material is described by blending at least one rubber compound, at least amine resin and at least thermally conductive filler, which takes the form of a liquid or "soft gel".
Proceedings ArticleDOI
Thermal modeling of grease-type interface material in PPGA application
TL;DR: In this article, the authors focus on the application of thermal grease to Plastic Pin Grid Array (PPGA) packages and thermal modeling of the resulting interface between the PPGA package and the heat sink.
Proceedings ArticleDOI
Low melting point thermal interface material
R.L. Webb,J.P. Gwinn +1 more
TL;DR: In this article, a high performance thermal interface material has been developed that consists of a 25 /spl mu/m coating of low-melting-temperature alloy (LMTA) tinned on each side of a 50 /spl µ/m copper substrate.