Journal ArticleDOI
Polishing behavior of PS/CeO2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP
Yang Chen,Renwei Long +1 more
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TLDR
In this paper, organic-inorganic composite microspheres with PS as a core and CeO2 nanoparticles as a shell were synthesized by in situ decomposition reaction of Ce(NO3)3 on the surfaces of PS microsheres prepared through soap-free emulsion polymerization.About:
This article is published in Applied Surface Science.The article was published on 2011-08-01. It has received 64 citations till now. The article focuses on the topics: Composite number.read more
Citations
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Enhanced Gas Sensing Properties of SnO2 Hollow Spheres Decorated with CeO2 Nanoparticles Heterostructure Composite Materials
Jiangyang Liu,Mingjun Dai,Tianshuang Wang,Peng Sun,Xishuang Liang,Geyu Lu,Kengo Shimanoe,Noboru Yamazoe +7 more
TL;DR: Compared with pure SnO2 hollow spheres, CeO2/SnO2 composites revealed excellent enhanced sensing properties to ethanol, and the sensing mechanism of the enhanced gas sensing properties was discussed.
Journal ArticleDOI
Polymethylmethacrylate (PMMA)/CeO2 hybrid particles for enhanced chemical mechanical polishing performance
Yang Chen,Zhina Li,Naiming Miao +2 more
TL;DR: In this article, the organic/inorganic hybrid particles with polymethylmethacrylate (PMMA) spheres as inner cores and ceria nanoparticles as outer shells were synthesized via electrostatic interaction.
Journal ArticleDOI
Novel polystyrene/CeO2-TiO2 multicomponent core/shell abrasives for high-efficiency and high-quality photocatalytic-assisted chemical mechanical polishing of reaction-bonded silicon carbide
TL;DR: In this paper, a modified process to synthesize the core/shell abrasives, which possessed a particular yielding effect and an enhanced photocatalytic activity, was proposed to obtain better polishing quality and higher material removal rates.
Journal ArticleDOI
RE (La, Nd and Yb) doped CeO2 Abrasive Particles for Chemical Mechanical Polishing of Dielectric Materials: Experimental and Computational Analysis
TL;DR: In this paper, a modified incipient impregnation method was used to improve the content of Ce3+ in CeO2 as polishing, and the polishing rate of silica was accelerated by 29.6% in alkaline slurries.
Journal ArticleDOI
Synthesis of Core-Shell Micro/Nanoparticles and Their Tribological Application: A Review.
TL;DR: The synthesis methods, the tribological applications (acted as solid/liquid lubricant additive, chemical mechanical polishing abrasives and basic units of lubricant matrix), and the functionary mechanisms of core–shell micro/nanoparticles were systematically reviewed, and the future development of core-shell micro-nanoparticle in tribology was also prospected.
References
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Journal ArticleDOI
Chemical processes in glass polishing
TL;DR: In this article, a detailed mechanico-chemical model for the glass polishing process is proposed, and the central chemical process which occurs is the interaction of both the glass surface and the polishing particle with water.
Journal ArticleDOI
Converting Ceria Polyhedral Nanoparticles into Single-Crystal Nanospheres
Xiangdong Feng,Dean C. Sayle,Zhong Lin Wang,Zhong Lin Wang,M. Sharon Paras,Brian Santora,Anthony C. Sutorik,Thi X. T. Sayle,Yi Yang,Yong Ding,Xudong Wang,Yie-Shein Her +11 more
TL;DR: This work developed an approach for large-scale synthesis of single-crystal ceria nanospheres that can reduce the polishing defects by 80% and increase the silica removal rate by 50%, facilitating precise and reliable mass-manufacturing of chips for nanoelectronics.
Journal ArticleDOI
A novel preparation method of raspberry-like PMMA/SiO2 hybrid microspheres
TL;DR: In this paper, the Raspberry-like organic-inorganic hybrid microspheres with PMMA as core and nanosilica particles as shell were prepared using a cationic monomer, 2-(methacryloyl)ethyltrimethylammonium chloride (MTC).
Journal ArticleDOI
Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects
TL;DR: In this paper, the effects of oversize particle contamination in chemical mechanical polishing (CMP) slurries were investigated on the silica CMP process and the limits of light scattering technique were established in detecting coarse particles in a commercial silica cMP slurry using two different methods.
Journal ArticleDOI
Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria
TL;DR: In this paper, thermal oxide covered silicon wafers were polished with slurries containing either nano-sized ceria (CeO2) or newly prepared uniform colloidal silica particles coated with ceria.
Related Papers (5)
Polymethylmethacrylate (PMMA)/CeO2 hybrid particles for enhanced chemical mechanical polishing performance
Yang Chen,Zhina Li,Naiming Miao +2 more