Patent
Process for manufacturing solar cell
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TLDR
In this paper, a method of manufacturing a solar cell having a texture on a surface of a silicon substrate has been proposed, which includes a first process of forming a porous silicon layer on the surface of the silicon substrate by dipping the substrate into a mixed aqueous solution of an oxidizing reagent containing a metal ion and hydrofluoric acid.Abstract:
A solar cell manufacturing method provides a method of manufacturing a solar cell having a texture on a surface of a silicon substrate, to obtain the solar cell manufacturing method capable of manufacturing a solar cell of high performance in a simple manufacturing process. The solar cell manufacturing method includes a first process of forming a porous silicon layer on the surface of the silicon substrate by dipping the silicon substrate into a mixed aqueous solution of an oxidizing reagent containing a metal ion and hydrofluoric acid, and a second process of forming a texture by etching the surface of the silicon substrate after passing the first process, by dipping the silicon substrate into a mixed acid mainly containing hydrofluoric acid and nitric acid.[r]A method of manufacturing a solar cell having a texture on a surface of a silicon substrate includes first forming including forming a porous layer on the surface of the silicon substrate by dipping the silicon substrate into a mixed aqueous solution of oxidizing reagent containing metal ions and hydrofluoric acid; and second forming including forming a texture by etching the surface of the silicon substrate after the first forming by dipping the silicon substrate into a mixed acid mainly containing hydrofluoric acid and nitric acid.read more
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Patent
Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates
Simon Braun,Andreas Klipp,Cornelia Roeger-Goepfert,Christian Bittner,Meichin Shen,Chengwei Lin +5 more
TL;DR: An aqueous acidic etching solution suitable for texturing the surface of single crystal and polycrystal silicon substrates and containing, based on the complete weight of the solution, 3 to 10% by weight of hydrofluoric acid, 10 to 35% of nitric acid, 5 to 40% of sulfuric acid, and 55 to 82% of water was proposed in this article.
Patent
Texturing method of polycrystalline silicon wafer cut by diamond wire
TL;DR: In this paper, a texturing method of polycrystalline silicon wafer cut by a diamond wire is described, which consists of the following steps: first, immersing the polycrystaline silicon wire cut by the diamond wire into a mixed water solution of an alkaline solution and an alkaline reaction control agent, removing a surface damage layer of the silicon wire, and then placing it into a hydrofluoric acid solution containing inorganic ions and organic molecules.
Patent
Method for cleaning silicon substrate, and method for producing solar cell
TL;DR: In this paper, a method for cleaning a silicon substrate involving: a first step for forming a porous layer on the surface of the silicon substrate by using a mixed aqueous solution of an oxidant and hydrofluoric acid, a second step for texturizing the surface by etching the holes on the porous layer with a mixed acid of mainly hydroporic acid and nitric acid, and a third step for removing metal and organic impurities in the holes by generating air bubbles within the holes formed on the silicon substrates.
Patent
Texturing pretreatment liquid and texturing pretreatment method for diamond wire cutting polycrystalline silicon sheet, texturing pretreatment silicon sheet and application of texturing pretreatment silicon sheet
TL;DR: In this article, a texturing pretreatment liquid for a diamond wire cutting polycrystalline silicon sheet is provided, in which a uniform and low-reflexibility textured surface is formed on the surface of the silicon sheet.
Patent
Single-surface texturing method for diamond wire cut polycrystalline silicon wafer, and diamond wire cut polycrystalline silicon wafer with single surface textured
TL;DR: In this article, a single-surface texturing method for a diamond wire cut polycrystalline silicon wafer is presented. But the method is not suitable for textured surfaces and it cannot be applied to textured materials.
References
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Journal ArticleDOI
Black nonreflecting silicon surfaces for solar cells
TL;DR: In this article, a wet chemical process for nanoscale texturing of Si surfaces is presented, which results in an almost complete suppression of the reflectivity in a broad spectral range, leading to black Si surfaces.
A simplified process for isotropic texturing of mc-Si
TL;DR: In this paper, an isotropic etch consisting of only HF and HNO/sub 3/ was proposed, which leads to comparable improvements in reflection and I-V characteristics but is easier to handle and less critical during the etch process.
Patent
Solar cell and method for producing the same
TL;DR: A solar cell is defined as a semiconductor substrate having a pn junction and a plurality of microscopic depressions formed in a light-receiving surface thereof, a front electrode formed on the light receiving surface of the substrate; and a rear electrode forming on a rear surface of a substrate.
Patent
Method for producing multicrystalline silicon substrate for solar cells
TL;DR: In this paper, a method for producing a multicrystalline silicon substrate for solar cells is described, which consists of a metal deposition step for depositing such metal particles as platinum and silver on the surface of the substrate by electroless-plating chloroplatinic acid or silver perchlorate; a boring step for subjecting the substrate surface to etching in a solution containing at least one of hydrofluoric acid and hydrogen peroxide; and a step for removing a stain layer by immersing a substrate into an alkaline solution.
Patent
Manufacture of solar cell element
TL;DR: In this article, the shape of the uneven part is optimized by introducing gas for flattening a shape simultaneously or continuously after the very small uneven part 1b is formed, and a mask and etching gas are simultaneously introduced in the dry etching apparatus.