Patent
Semiconductor package and method for fabricating the same
TLDR
In this paper, a semiconductor package and a method for fabricating the same is presented, which includes a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern and selectively exposing the plurality of ball and ball.Abstract:
There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.read more
Citations
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References
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Patent
Radio frequency identification system
TL;DR: In this paper, a transponder reader can be configured to read FSK and PSK encoded signals from a transmodal radio frequency identification (RFID) system with an attached controller.
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Semiconductor chip assemblies with fan-in leads
TL;DR: In this article, a semiconductor chip having contacts on the periphery of its top surface is provided with an interposer overlying the central portion of the top surface, where peripheral contact leads extend inwardly from the peripheral contacts to central terminals on the interposers.
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TL;DR: In this article, a semiconductor chip assembly is mounted to contact pads in a compact area array, and an interposer is disposed between the chip and the substrate, where contacts on the chip are connected to terminals on the interposers by flexible leads extending through apertures in the interPOSer.
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