Originally published in IEEE Transactions on Components and Packaging Technology Vol. 26 No. 1. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.

Gold nanoparticles are formed to cover the surface of sulfonated-polystyrene (PS) beads by the in-situ ion-exchange and chemical reduction of a stable cationic gold ligand, which makes it different from the physical adsorption or multiple electroless metallization methods. PS beads are synthesized by dispersion polymerization with a diameter of 2.7 μm, and their surface is modified by introducing sulfonic acid groups (SO - 3 ) to give an ion exchange capacity of up to 2.25 mequiv. g -1 , which provides 1.289 x 10 10 SO 3 per bead. Subsequently, the anionic surface of the PS beads is incorporated with a cationic gold ligand, dichlorophenanthrolinegold(III) chloride ([AuCl 2 (phen)]Cl), through an electrostatic interaction in the liquid phase to give gold nanoparticles (ca. 1-4 nm in diameter) formed on the PSo surface. Assuming that approximately three SO - 3 groups interact with one [Aucl 2 (phen)] + ion in the ion-exchange process, the gold coverage on a PS bead is estimated as 12.0 wt.-%, which compares well with the 16.8 wt.-% of gold loading measured by inductively coupled plasma-mass spectrometry. Because of the adjustable IEC values of the polymer surface and the in-situ metallization of Au in the presence of S atoms, both of which are of a soft nature, the developed methodology could provide a simple and controllable route to synthesize a robust metal coating on the polymer bead surface.

http://home.skku.edu/~jdnam/article/outside/No76-MacRap_Direct_2007_3.pdf

Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track

Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands

2003 Index IEEE Transactions on Components and Packaging Technologies Vol. 26

Recently, It has been reported that the spin sprayed ferite film shows better magnetic properties at high frequeny that the ferrite by co-firing over . Besides, there is no limitation to select the substrate materials because it can be processed with relatively low temperature below . Therefore, we fabricated film inductor as a passive device for DC-DC converter by a use of spin sprayed embedded form was completed by via hole process of pad opening. Saturation magnetization of 0.61 T and real part of permeability of 110 were obtained in Ni-Zn ferrite. In addition, inductance of 1.52 , quality factor of 24.3 at 5 MHz were measured with spiral 16 turn inductor. The rated current of inductor was 863 mA.

Embedded Ferrite Film Inductor in PCB Substrate

/pdf/special-section-on-components-and-packaging-technologies-22nw2f01zi.pdf

Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track

Citations

Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold Ligands

2003 Index IEEE Transactions on Components and Packaging Technologies Vol. 26

Embedded Ferrite Film Inductor in PCB Substrate

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