Proceedings ArticleDOI
Thermal optimization in a power electronic supply
F. Belaid,A. Skorek,Y. Dube +2 more
- pp 519-526
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TLDR
In this paper, a thermal optimization algorithm of the power devices's positions on the heat sink by means of the NISA II-PC application program is proposed, based on an elaborate thermal and electrical converter model and the three-dimensional finite element method.Abstract:
With every-increasing requirements for higher frequency and higher power electronic converters, thermal management considerations and means for thermal analysis have become of great importance. A thermal optimization algorithm of the power devices's positions on the heat sink by means of the NISA II-PC application program is proposed. This algorithm is based on an elaborate thermal and electrical converter model and the three-dimensional finite element method. >read more
Citations
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Proceedings ArticleDOI
Evaluating thermal management efficiency in converters
TL;DR: Thermal management in power electronic converters ensures that all components operate within their safe operating temperature throughout its total dynamic range whilst taking into account the invested material and volume to achieve them.
Proceedings ArticleDOI
A comparative study of two simulation methods for thermal analysis of power electronic devices
TL;DR: The authors compare two methods applied to 3D temperature map computation of power hybrid circuits, the conventional FE method and the so-called thermal influence coefficient method, a specific procedure devised for fast temperature computations of hybrid power circuits.
Evaluating Thermal Management Efficiency in Converters
TL;DR: In this article, a method is developed to quantify the extent to which a given thermal management design accomplishes this objective in power electronic converters whilst taking into account the invested material and volume to achieve them.
References
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Proceedings ArticleDOI
Monte Carlo thermal optimization of populated printed circuit board
TL;DR: In this paper, the authors presented the methodology and results of a Monte Carlo optimization of component placement on a printed circuit board and the overall reliability of the component mix on the printed circuit boards is the criterion of optimality.
Journal ArticleDOI
Analysis of the collocation time finite element method for the non‐linear heat transfer equation
TL;DR: In this paper, a modification of the well-known generalized midpoint method has been proposed, which is applied to the one-dimensional nonlinear heat transfer equation, and the proposed algorithm is capable of improved performance over the standard generalized mid point method.
Proceedings ArticleDOI
Thermal resistance measurements and finite element calculations for ceramic hermetic packages
J.N. Sweet,W.T. Cooley +1 more
TL;DR: In this paper, the junction-to-case thermal resistance of a 40 pin leadless chip carrier (LCC) ceramic hermetic package (CHP) was measured with the bottom attached to a heat sink and with the package convectively cooled in a fluid bath.
Journal ArticleDOI
Determination of power semiconductor model parameter values from structure data
TL;DR: In this paper, the authors present equations for an scr model suitable for cad implementation, where the model components are specified in terms of the device doping profile and junction areas and data is presented for medium power inverter and converter scr's.