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Transistor and process for fabricating the same

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TLDR
In this paper, a process for fabricating a thin-film transistor, which comprises crystallizing an amorphous silicon film, forming thereon a gate insulating film and a gate electrode, implanting impurities in a self-aligned manner, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities.
Abstract
A process for fabricating a thin film transistor, which comprises crystallizing an amorphous silicon film, forming thereon a gate insulating film and a gate electrode, implanting impurities in a self-aligned manner, adhering a coating containing a catalyst element which accelerates the crystallization of the silicon film, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities. Otherwise, the catalyst element can be incorporated into the structure by introducing it into the impurity region by means of ion implantation and the like. Also a process for fabricating a thin film transistor, which comprises forming a gate electrode, a gate insulating film, and an amorphous silicon film on a substrate, implanting impurities into the amorphous silicon film to form source and drain regions as the impurity regions, introducing a catalyst element into the impurity region by adhering a coating containing the catalyst element of by means of ion doping and the like, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities.

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References
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Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device

TL;DR: In this paper, a high performance thin-film semiconductor device using a low temperature process in which it is possible to use low price glass substrates has been fabricated by forming a silicon film at less than 450° C, and, after crystallization, keeping the maximum processing temperature at or below 350° C.
Patent

Thin-film transistor

TL;DR: In this paper, a gate-insulated thin-film transistor with a halogen block in between the blocking layer and a gate insulator is described. But the block is not used to prevent the transistor from being contaminated with impurities such as alkali ions.
Patent

Anisotropic deposition of silicon dioxide

TL;DR: In a radio-frequency plasma deposition reactor (10), SiO 2 is deposited from a source (16) of tetraethoxysilane (TEOS), the deposition is made to be anisotropic, that is, to be deposited preferentially on horizontal surfaces, by use in the deposition atmosphere of a constituency such as NH 3 or NF 3, along with a radiofrequency power in excess of 100 watts, which preferencesially removes the inhibiting gas from horizontal surfaces through ion impact.
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Low temperature crystallization and pattering of amorphous silicon films

TL;DR: In this paper, a very thin discontinuous film of a nucleating site forming material over the amorphous Si prior to rapid thermal anneal is used to reduce the temperature of polycrystalline Si to a temperature range from 550° C to 650° C.
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Method for manufacturing semiconductor device

TL;DR: In this article, an impurity is injected into a polycrystalline Si film 45, and the impurity ions are diffused to an Si substrate 11 to form diffusion layers 26, 32.