Patent
Vacuum processing system
Cecil J. Davis,Timothy A. Wooldridge,Duane E. Carter,John E. Spencer,Robert T. Matthews,Randall C. Hildenbrand +5 more
TLDR
In this article, a vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock.Abstract:
A system for performing one semiconductor manufacturing operation or sequence of operations with reduced particulate contamination. A vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock. The platform contains slots and protruding fingers to provide accurate registration of the position of the wafer carrier. After the load lock is pumped down, the door of the wafer carrier is opened, and a transfer arm removes wafers from the wafer carrier, in any desired order, and transfers them one by one through a port into a processing chamber.read more
Citations
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Patent
Processing apparatus and method
TL;DR: In this article, a process module is proposed where the susceptor is directly heated by a radiant heater, but the rate of temperature change is slow enough that no large thermal gradients between the susceptors and the wafer develop.
Patent
Modular wafer transport and processing system
TL;DR: In this article, a modular wafer processing machine is provided which is based on interconnected handling units having wafer handling arms, each unit can pass a wafer to another unit in the same vacuum environment to a processing module.
Patent
Self-aligning lift mechanism
TL;DR: In this article, a self-aligning lift mechanism for lifting the stem of a pedestal in a processing chamber while minimizing process anomalies due to geometric misalignment and binding of moving pieces is presented.
Patent
Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
Jaim Nulman,Kenny King-Tai Ngan +1 more
TL;DR: In this article, a process for forming, over a silicon surface, a titanium nitride barrier layer having a surface of (111) crystallographic orientation is described, which is used to provide protection of the underlying silicon against spiking of the aluminum.
Patent
Multiple Slot Load Lock Chamber and Method of Operation
TL;DR: In this paper, a load lock chamber is used to transfer a substrate from a transfer cavity to a heating cavity formed in the chamber body, and the substrate support is movable between a first elevation and a second elevation.
References
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Patent
Device for automatically transporting disk shaped objects
TL;DR: In this paper, an automatic transport of disk shaped objects from a discharge cassette adjustable in height through a position adjusting station to an inspection table and further into depository cassettes which are also adjustable in length in a step-wise manner.
Patent
Apparatus for conveying a semiconductor wafer
TL;DR: In this article, a transfer apparatus for conveying a semiconductor wafer between a first location (42) at first pressure and a second location (12) at second pressure comprises a substantially airtight transfer chamber (26) having clos-able ports (38, 40) and transfer arm means (84) including first and second elongated arm members (86, 88) each having first or second ends.
Patent
Material handling system and method for manufacturing line
TL;DR: In this paper, a material handling system which can be utilized for electronic component manufacturing, such as semiconductor slices, at sub-mospheric conditions is described. But, the system is not suitable for the use of large numbers of components.
Patent
Dry etching apparatus
TL;DR: In this article, a dry-etching method was proposed for removing chlorides deposited on the surface of the wafer during the dry etching of a wafer, as well as an etching resist film.
Patent
Automatic plasma processing device and heat treatment device for batch treatment of workpieces
TL;DR: In this article, an automatic plasma processing device with a substantially vertically disposed plasma chamber in which a plurality of semiconductor wafers are processed with plasma simultaneously is presented. But, it is not shown how to operate the plasma chamber.