What are some common applications of materials with high thermal conductivity in 3D printing?
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Materials with high thermal conductivity find common applications in 3D printing for various purposes. These applications include the development of high thermal conductivity nanocomposites, the fabrication of 3D-printed carbon fiber composites with enhanced thermal conductivity, the preparation of composites with highly oriented hexagonal boron nitride (hBN) for improved thermal conductivity and mechanical properties, the creation of continuous mesophase-pitch-based carbon fiber/thermoplastic polyurethane/epoxy composites for directional heat conduction, and the coaxial 3D printing of anisotropic thermal conductive composite aerogels for electronics. These applications showcase the versatility and potential of materials with high thermal conductivity in advancing the capabilities of 3D printing technology for various industries.
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| Papers (5) | Insight |
|---|---|
| Materials with high thermal conductivity in 3D printing, like CMPCF/TPU/epoxy composites, find applications in spacecraft components, electronics cooling systems, and high-performance thermal management products. | |
| Materials with high thermal conductivity in 3D printing, like the coaxial composite aerogel in the study, find applications in electronics for custom-tailored products due to their anisotropic thermal properties. | |
25 Sep 2022 | Materials with high thermal conductivity in 3D printing, like the oriented BN-epoxy composite resin, find applications in power devices due to enhanced heat dissipation efficiency and mechanical properties. |
1 Citations | Materials with high thermal conductivity in 3D printing, like the 3D-printed continuous pitch carbon fiber composites, can be utilized in applications requiring efficient heat transfer, such as aerospace components and electronic devices. |
| High thermal conductivity polymer composites in 3D printing find applications in flexible electronic devices to enhance heat dissipation, improving performance and longevity of components. |
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