Showing papers on "Electronic packaging published in 1981"

Electronic packaging evolution in IBM

Abstract: A quarter century of innovation in the development of packaging for semiconductors has culminated in the announcement of the IBM 4300 Series of computers and the IBM 3081. This technology has been built on a broad and expanding base starting with packaging for the 1400 Series in thel ate 1950s. In the next series, System/360, IBM chose to follow a unique approach which employed solder joints for the semiconductor connections, allowing ultimately a higher density and total number of interconnections compared to the rest of the industry. This has driven the packaging at the module level to achieve extremely high density and has led to multichip interconnections and multilayers on this first level of package. The dramatically increasing circuit function at the module level requires area arrays of pins to be able to get enough of them in a small area. Thus the nexlte vel (second level) of packaging has likewise been driven to provide many layers of dense interconnections to link to the module pins. New types of plated through holes join the many layers of interconnection. The highlights of the technical approaches which have been developed over the twenty-five-year period are discussed briefly in this paper.

The Reflow Attachment and Reliability Testing of Ceramic Chip Carriers

Abstract: The results of an extensive program for the solder reflow attachment and reliability testiny of ceramic chip carriers for use in space satellites, implantable biomedical electronics, and underwater instrumentation are discussed in detail. The program was divided in three major parts; 1) the packaging of integrated circuit chips in ceramic carriers; 2) the selection and qualification of solders, reflow methods and cleaning processes; and 3) the validation of the chip carrier-substrate system for high reliability applications. Military Standard environmental testing of ceramic chip carriers alone and carriers attached to thin film and thick film (multilayer) ceramic substrates, glass, sapphire, and various printed wire circuit boards has been conducted. Test results are presented for various carrier-substrate-solder combinations along with discussions of associated failure modes and fabrication problem areas.

Chip Carriers-Their Application and Future Direction

Abstract: The need for chip carriers and chip-carrier standards is reviewed. Chip-carrier telecommunications applications as well as thermal characteristics of chip carriers are presented. Impediments to chip-carrier applications as well as future directions are reviewed.

Electronic packaging technique

Abstract: Heat sink segments which are longitudinal sections of metal cylinders supt planar circuit elements and are pivotally mounted on bulkheads to gain access to circuit elements.