Showing papers on "Photomask published in 1973"

Method and means for forming an aligned mask that does not include alignment marks employed in aligning the mask

Abstract: An automatic alignment and exposure system is employed for aligning a pair of alignment marks on a semiconductive wafer with a corresponding pair of alignment marks on a photomask to align the semiconductive wafer with the photomask. The automatic alignment and exposure system is also employed for directing exposure light through the alignment-mark-containing portions of the photomask onto corresponding portions of a photosensitive film of etch-resistant material on the semiconductive wafer to fully expose those portions of the photosensitive film and for directing exposure light through the photomask onto the entire unmasked surface of the photosensitive film to selectively expose the photosensitive film in accordance with the pattern of the photomask. Following this exposure operation, either the unexposed or the exposed portions of the photosensitive film are removed from the semiconductive wafer, thereby leaving an etchresistant mask that does not include the alignment marks of the photomask.

Method of making a semitransparent photomask

Abstract: A METHOD COMPRISING ELECTROLESSLY DEPOSITING A SEMITRANSPARENT FILM WHICH IS PREDOMINANTLY CUPROUS OXIDE OM A TRANSPARENT SUBSTRATE AND DELINEATING A PATTERN IN THE FILM BY ETCHING.