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A.E.M. De Veirman
Researcher at Philips
Publications - 26
Citations - 528
A.E.M. De Veirman is an academic researcher from Philips. The author has contributed to research in topics: Microstructure & Thin film. The author has an hindex of 12, co-authored 26 publications receiving 519 citations. Previous affiliations of A.E.M. De Veirman include NXP Semiconductors.
Papers
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On the ferromagnetic interlayer coupling in exchange-biased spin-valve multilayers
TL;DR: In this article, the ferromagnetic interlayer coupling in sputterdeposited permalloy/copper/permalloy exchange-biased spin valve multilayers has been measured as a function of the copper thickness.
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Columnar microstructures in magnetron-sputtered refractory metal thin films of tungsten, molybdenum and W-Ti-(N)
TL;DR: In this article, the relationship between stresses and microstructure was analyzed with transmission electron microscopy using the cross-sectional technique, and the influence of the sputter gas pressure on both micro-structure and stress state for the case of molybdenum thin films.
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Structural and electrical characterization of heteroepitaxial lead zirconate titanate thin films
M. de Keijser,Johannes Franciscus Maria Cillessen,R. B. F. Janssen,A.E.M. De Veirman,Dago M. de Leeuw +4 more
TL;DR: In this article, the microstructure of PbZrxTi1−xO3 films on (001)SrTiO3 was studied as a function of the zirconium fraction, x.
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In situ X-ray diffraction: a useful tool to investigate hydride formation reactions
TL;DR: In this paper, a high-pressure X-ray diffraction (XRD) cell has been designed which allowed us to study simultaneously hydrogen absorption/desorption isotherms and XRD powder diffraction patterns on (de)hydrided intermetallic compounds.
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Inverted spin valves for magnetic heads and sensors
TL;DR: In this article, a Ni80Fe20 buffer layer was proposed to provide a significantly increased magnetoresistance ratio compared to the usual Cu buffer, which made it possible to use inverted spin valves instead of conventional spin valves in magnetic heads and sensors.