An ultrawideband 3.1-10.6-GHz low-noise amplifier employing an input three-section band-pass Chebyshev filter is presented. Fabricated in a 0.18-/spl mu/m CMOS process, the IC prototype achieves a power gain of 9.3 dB with an input match of -10 dB over the band, a minimum noise figure of 4 dB, and an IIP3 of -6.7 dBm while consuming 9 mW.

An ultrawideband CMOS low-noise amplifier for 3.1-10.6-GHz wireless receivers

Modern and future ultra-deep-submicron (UDSM) technologies introduce several new problems in analog design. Nonlinear output conductance in combination with reduced voltage gain pose limits in linearity of (feedback) circuits. Gate-leakage mismatch exceeds conventional matching tolerances. Increasing area does not improve matching any more, except if higher power consumption is accepted or if active cancellation techniques are used. Another issue is the drop in supply voltages. Operating critical parts at higher supply voltages by exploiting combinations of thin- and thick-oxide transistors can solve this problem. Composite transistors are presented to solve this problem in a practical way. Practical rules of thumb based on measurements are derived for the above phenomena.

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Analog circuits in ultra-deep-submicron CMOS

An ultra-wideband 3.1-10.6-GHz low-noise amplifier employing a broadband noise-canceling technique is presented. By using the proposed circuit and design methodology, the noise from the matching device is greatly suppressed over the desired UWB band, while the noise from other devices performing noise cancellation is minimized by the systematic approach. Fabricated in a 0.18-mum CMOS process, the IC prototype achieves a power gain of 9.7 dB over a -3 dB bandwidth of 1.2-11.9-GHz and a noise figure of 4.5-5.1 dB in the entire UWB band. It consumes 20 mW from a 1.8-V supply and occupies an area of only 0.59 mm2

A Broadband Noise-Canceling CMOS LNA for 3.1–10.6-GHz UWB Receivers

The RF noise in 0.18-/spl mu/m CMOS technology has been measured and modeled. In contrast to some other groups, we find only a moderate enhancement of the drain current noise for short-channel MOSFETs. The gate current noise on the other hand is more significantly enhanced, which is explained by the effects of the gate resistance. The experimental results are modeled with a nonquasi-static RF model, based on channel segmentation, which is capable of predicting both drain and gate current noise accurately. Experimental evidence is shown for two additional noise mechanisms: 1) avalanche noise associated with the avalanche current from drain to bulk and 2) shot noise in the direct-tunneling gate leakage current. Additionally, we show low-frequency noise measurements, which strongly point toward an explanation of the 1/f noise based on carrier trapping, not only in n-channel MOSFETs, but also in p-channel MOSFETs.

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Noise modeling for RF CMOS circuit simulation

A broadband inductorless low-noise amplifier (LNA) design that utilizes simultaneous noise and distortion cancellation is presented. Concurrent cancellation of the intrinsic third-order distortion from individual stages is exhibited with the common-gate and common-source cascade. The LNA is then limited by the second-order interaction between the common source and common gate stages, which is common in all cascade amplifiers. Further removal of this third-order distortion is achieved by incorporating a second-order-distortion-free circuit technique in the common gate stage. Implemented in 0.13 m CMOS technology, this LNA achieved 16 dBm in both the 900 MHz and 2 GHz bands. Measurements demonstrate that the LNA has a minimum internal gain of 14.5 dB, noise figure of 2.6 dB from 800 MHz to 2.1GHz while drawing 11.6 mA from 1.5 V supply voltage.

A Highly Linear Broadband CMOS LNA Employing Noise and Distortion Cancellation

The impact of scaling on the analog performance of MOS devices at RF frequencies was studied. Trends in the RF performance of nominal gate length NMOS devices from 350-nm to 50-nm CMOS technologies are presented. Both experimental data and circuit simulations with an advanced validated compact model (MOS Model 11) have been used to evaluate the RF performance. RF performance metrics such as the cutoff frequency, maximum oscillation frequency, power gain, noise figure, linearity, and 1/f noise were included in the analysis. The focus of the study was on gate and drain bias conditions relevant for RF circuit design. A scaling methodology for RF-CMOS based on limited linearity degradation is proposed.

RF-CMOS performance trends

This paper studies the suitability of CMOS device technology for mixed-signal applications. The currently proposed scaling scenario's for CMOS technologies lead to strong degradation of analog transistor performance. As a result the combined optimization of digital and analog devices for system-on-a-chip applications will require increasingly elaborate process modifications. New device solutions such as metal gate integration and asymmetric (source-side-only) workfunction modification offer process options for future mixed-signal CMOS applications.

CMOS device optimization for mixed-signal technologies

The influence of the gate-oxide thickness, the substrate dope, and the gate bias on the input-referred spectral 1/f noise density Sv/sub gate/ has been experimentally investigated It is shown that the dependence on the oxide thickness and the gate bias can be described by the model of Hung, and that Sv/sub gate/ can be predicted for future technologies Discrepancies with the ITRS roadmap are discussed

Impact of process scaling on 1/f noise in advanced CMOS technologies

A model for RF CMOS circuit design is presented that is capable of predicting drain and gate current noise without adjusting any parameters. Additionally, the presence of (i) noise associated with avalanche multiplication, and (ii) shot noise of the direct-tunneling gate current in leaky dielectrics is revealed.

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A.T.A. Zegers-van Duijnhoven

Papers

Noise modeling for RF CMOS circuit simulation

RF-CMOS performance trends

CMOS device optimization for mixed-signal technologies

Impact of process scaling on 1/f noise in advanced CMOS technologies

Compact modeling of drain and gate current noise for RF CMOS