There are two kinds of tutorial articles: those that provide a primer on an established topic and those that let us in on the ground floor of something of emerging importance. The first type of tutorial can have a noted expert who has been gracious (and brave) enough to write a field guide about a particular topic. The other sort of tutorial typically involves researchers who have each been laboring on a topic for some years. Both sorts of tutorial articles are very much desired. But we, as an editorial board for both Systems and Transactions, know that there has been no logical place for them in the AESS until this series was started several years ago. With these tutorials, we hope to continue to give them a home, a welcome, and provide a service to our membership. We do not intend to publish tutorials on a regular basis, but we hope to deliver them once or twice per year. We need and welcome good, useful tutorial articles (both kinds) in relevant AESS areas. If you, the reader, can offer a topic of interest and an author to write about it, please contact us. Self-nominations are welcome, and even more ideal is a suggestion of an article that the editor(s) can solicit. All articles will be reviewed in detail. Criteria on which they will be judged include their clarity of presentation, relevance, and likely audience, and, of course, their correctness and scientific merit. As to the mathematical level, the articles in this issue are a good guide: in each case the author has striven to explain complicated topics in simple-well, tutorial-terms. There should be no (or very little) novel material: the home for archival science is the Transactions Magazine, and submissions that need to be properly peer reviewed would be rerouted there. Likewise, articles that are interesting and descriptive, but lack significant tutorial content, ought more properly be submitted to the Systems Magazine.

What is a tutorial

Nonlinear Oscillations: Exact Solutions and their Approximations

Industry 4.0: A bibliometric analysis and detailed overview

An ideal anti-counterfeiting technique has to be inexpensive, mass-producible, nondestructive, unclonable and convenient for authentication. Although many anti-counterfeiting technologies have been developed, very few of them fulfill all the above requirements. Here we report a non-destructive, inkjet-printable, artificial intelligence (AI)-decodable and unclonable security label. The stochastic pinning points at the three-phase contact line of the ink droplets is crucial for the successful inkjet printing of the unclonable security labels. Upon the solvent evaporation, the three-phase contact lines are pinned around the pinning points, where the quantum dots in the ink droplets deposited on, forming physically unclonable flower-like patterns. By utilizing the RGB emission quantum dots, full-color fluorescence security labels can be produced. A convenient and reliable AI-based authentication strategy is developed, allowing for the fast authentication of the covert, unclonable flower-like dot patterns with different sharpness, brightness, rotations, amplifications and the mixture of these parameters.

Inkjet-printed unclonable quantum dot fluorescent anti-counterfeiting labels with artificial intelligence authentication.

Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the developments of LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 lumens/W, this is approximately 6 times the efficiency of a conventional incandescent tungsten bulb. Thermal management for the solid-state lighting applications is a key design parameter for both package and system level. Package and system level thermal management is discussed in separate sections. Effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips. The higher thermal conductivity of the SiC chip provided about 2 times better thermal performance than the latter, while the under-filled Sapphire chip package can only catch the SiC chip performance. Later, system level thermal management was studied based on established numerical models for a conceptual solid-state lighting system. A conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.

Thermal management of LEDs: Package to system

Polymer optics have gained increasing importance in recent years. With advancing requirements for the optical components, the fabrication process remains a challenge. In particular, the fabrication of the mold inserts for the replication process is crucial for obtaining high-quality optical components. This review focuses on fabrication technologies for optical mold inserts. Thereby, two main types of technologies can be distinguished: fabrication methods to create mold inserts with optical surface quality and methods to create optical microstructures. Since optical mold inserts usually require outstanding form accuracies and surface qualities, a focus is placed on these factors. This review aims to give an overview of available methods as well as support the selection process when a fabrication technology is needed for a defined application. Furthermore, references are given to detailed descriptions of each technology if a deeper understanding of the processes is required.

https://www.mdpi.com/2072-666X/10/4/233/pdf

Review on Fabrication Technologies for Optical Mold Inserts.

Since the last five decades, polymer-derived ceramics (PDCs) are in use and envisaged for a variety of applications The transition of a precursor to an inorganic ceramic by pyrolysis and heat-trea

Mechanical behaviour of polymer derived ceramics – a review

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

Bending Setups for Reliability Investigation of Flexible Electronics

A Physical Unclonable Function uses random and inherent properties of a physical entity and can be used to uniquely identify components e.g., for anti-counterfeiting purposes. In this work we demonstrate that the surface patterns of injection moulded plastic components themselves are inherently unique and hence can be used as a PUF for reliable and secure identification. We further demonstrate that these unique surface patterns are easily accessible since they can be photographed with a simple camera set-up. This is exemplarily demonstrated for two different plastic materials on an overall of 200 injection moulded components. A set of brief experiments further examines the PUF's robustness towards real life conditions. This approach might be useful for secure identification and authentication of components or a label-free tracking.

/pdf/using-unique-surface-patterns-of-injection-moulded-plastic-4baycowddg.pdf

Using unique surface patterns of injection moulded plastic components as an image based Physical Unclonable Function for secure component identification

André Zimmermann

Papers

Review on Fabrication Technologies for Optical Mold Inserts.

Mechanical behaviour of polymer derived ceramics – a review

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Bending Setups for Reliability Investigation of Flexible Electronics

Using unique surface patterns of injection moulded plastic components as an image based Physical Unclonable Function for secure component identification