B
Burhan Ozmat
Researcher at Texas Instruments
Publications - 27
Citations - 1145
Burhan Ozmat is an academic researcher from Texas Instruments. The author has contributed to research in topics: Power module & Heat exchanger. The author has an hindex of 15, co-authored 26 publications receiving 1126 citations. Previous affiliations of Burhan Ozmat include Massachusetts Institute of Technology & IBM.
Papers
More filters
Patent
High performance integrated circuit packaging structure
TL;DR: In this paper, a high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures is presented, which allows a plurality of discrete semiconductor segments to be mounted on and interconnected by the integrated circuit package with a significantly reduced number of drivers and receivers than required by Rent's Rule.
PatentDOI
Method of partitioning, testing and diagnosing a vlsi multichip package and associated structure
Scott Laurence Jacobs,Maurice Thomas Mcmahon,Perwaiz Nihal,Burhan Ozmat,Henri Daniel Schnurmann,Arthur R. Zingher +5 more
TL;DR: A self-contained method and structure for partitioning, testing and diagnosing a multi-chip packaging structure was proposed in this article, which comprises the steps of electronically inhibiting all chips in the multichannel package except for the chip or chips under test, and comparing the signature obtained to a good machine simulation signature.
Journal ArticleDOI
Thermal Applications of Open-Cell Metal Foams
TL;DR: In this paper, the key structural and thermo-physical properties of reticulated metal foams (RMF) are reviewed and analytical expressions relating such properties to basic structural parameters are developed through mathematical modeling and experimental studies.
Patent
Module for packaging semiconductor integrated circuit chips on a base substrate
TL;DR: In this article, a personalized reference plane is incorporated to reduce package capacitance and keep the RC constant low, and the personalized plane has insulating regions extending at least partially through the plane at predetermined locations that coincide with long signal lines on the wiring layers.
Patent
Power electronic module packaging
Burhan Ozmat,Mustansir H. Kheraluwala,Eladio Clemente Delgado,Charles Steven Korman,Paul Alan Mcconnelee +4 more
TL;DR: In this article, a planar single or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure.