The detection and measurement of gas concentrations using the characteristic optical absorption of the gas species is important for both understanding and monitoring a variety of phenomena from industrial processes to environmental change. This study reviews the field, covering several individual gas detection techniques including non-dispersive infrared, spectrophotometry, tunable diode laser spectroscopy and photoacoustic spectroscopy. We present the basis for each technique, recent developments in methods and performance limitations. The technology available to support this field, in terms of key components such as light sources and gas cells, has advanced rapidly in recent years and we discuss these new developments. Finally, we present a performance comparison of different techniques, taking data reported over the preceding decade, and draw conclusions from this benchmarking.

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Optical gas sensing: a review

This article reviews the history, the present status and possible future developments of HgCdTe ternary alloy for infrared (IR) detector applications. HgCdTe IR detectors have been intensively developed since the first synthesis of this material in 1958. This article summarizes the fundamental properties of this versatile narrow gap semiconductor, and relates the material properties to its successful applications as an IR photoconductive and photovoltaic detector material. An emphasis is put on key developments in the crystal growth and their influence on device evolution. Competitive technologies to HgCdTe ternary alloy are also presented. Recent advances of backside illuminated HgCdTe heterojunction photodiodes have enabled a third generation of multispectral instruments for remote sensing applications and have led to the practicality of multiband IR focal plane array technology. Finally, evaluation of HgCdTe for room temperature long wavelength IR applications is presented. (Some figures in this article are in colour only in the electronic version)

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HgCdTe infrared detector material: history, status and outlook

Until very recently, handheld spectrometers were the domain of major analytical and security instrument companies, with turnkey analyzers using spectroscopic techniques from X-ray fluorescence (XRF) for elemental analysis (metals), to Raman, mid-infrared, and near-infrared (NIR) for molecular analysis (mostly organics). However, the past few years have seen rapid changes in this landscape with the introduction of handheld laser-induced breakdown spectroscopy (LIBS), smartphone spectroscopy focusing on medical diagnostics for low-resource areas, commercial engines that a variety of companies can build up into products, hyphenated or dual technology instruments, low-cost visible-shortwave NIR instruments selling directly to the public, and, most recently, portable hyperspectral imaging instruments. Successful handheld instruments are designed to give answers to non-scientist operators; therefore, their developers have put extensive resources into reliable identification algorithms, spectroscopic libraries or databases, and qualitative and quantitative calibrations. As spectroscopic instruments become smaller and lower cost, “engines” have emerged, leading to the possibility of being incorporated in consumer devices and smart appliances, part of the Internet of Things (IOT). This review outlines the technologies used in portable spectroscopy, discusses their applications, both qualitative and quantitative, and how instrument developers and vendors have approached giving actionable answers to non-scientists. It outlines concerns on crowdsourced data, especially for heterogeneous samples, and finally looks towards the future in areas like IOT, emerging technologies for instruments, and portable hyphenated and hyperspectral instruments.

https://journals.sagepub.com/doi/pdf/10.1177/0003702818809719

EXPRESS: Portable Spectroscopy:

In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device

Controlling electromechanical behavior of structures within a microelectromechanical systems device

The first decade of the 21st-century has seen a rapid development in infrared photodetector technology. At the end of the last millennium there were two dominant IR systems, InSb- and HgCdTe-based detectors, which were well developed and available in commercial systems. While these two systems saw improvements over the last twelve years, their change has not nearly been as marked as that of the quantum-based detectors (i.e., QWIPs, QDIPs, DWELL-IPs, and SLS-based photodetectors). In this paper, we review the progress made in all of these systems over the last decade plus, compare the relative merits of the systems as they stand now, and discuss where some of the leading research groups in these fields are going to take these technologies in the years to come.

Progress in Infrared Photodetectors Since 2000

This paper reports an investigation on techniques for determining elastic modulus and intrinsic stress gradient in plasma-enhanced chemical vapor deposition (PECVD) silicon nitride thin films. The elastic property of the silicon nitride thin films was determined using the nanoindentation method on silicon nitride/silicon bilayer systems. A simple empirical formula was developed to deconvolute the film elastic modulus. The intrinsic stress gradient in the films was determined by using micrometric cantilever beams, cross-membrane structures and mechanical simulation. The deflections of the silicon nitride thin film cantilever beams and cross-membranes caused by in-thickness stress gradients were measured using optical interference microscopy. Finite-element beam models were built to compute the deflection induced by the stress gradient. Matching the deflection computed under a given gradient with that measured experimentally on fabricated samples allows the stress gradient of the PECVD silicon nitride thin films introduced from the fabrication process to be evaluated.

https://iopscience.iop.org/article/10.1088/0960-1317/15/3/024/pdf

Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filters

Preliminary characterization results are presented for mid-wave infrared (MWIR) mercury cadmium telluride n-on-p photodiodes fabricated using a plasma induced type conversion junction formation technology. The diodes have been fabricated on three different vacancy doped p-type epitaxial starting materials, grown by liquid phase epitaxy (LPE) on CdZnTe, LPE on sapphire, and P/p isotype heterojunction material grown by molecular beam epitaxy (MBE) on CdZnTe. All materials had CdTe mole fraction in the active region of the device of ∼0.3. The process uses a H2/CH4 plasma generated in a parallel plate reactive ion etching (RIE) system to type convert the p-type material to n-type. The process is different from previously reported type conversion techniques in that it does not require a high temperature anneal, does not expose the junction at the surface to atmosphere after formation, and requires significantly fewer process steps than other planar processes. Homojunction devices fabricated using this process exhibit R0A values >107 Ω·cm2 at 80 K. The R0A is diffusion limited for temperatures >∼135 K. Results for responsivity, bias dependence of dynamic resistance — junction area product and 1/f noise show that the resulting diodes are comparable to the best planar diodes reported in the literature.

HgCdTe mid-wavelength IR photovoltaic detectors fabricated using plasma induced junction technology

Two experimental techniques have been investigated to examine residual stress in low-temperature plasma enhanced chemical vapour deposited (PECVD) SiNx thin films: one that measures the stress-induced substrate curvature, and the other that takes advantage of the stress-induced deformation of freestanding diagnostic microstructures. A general linear dependence of residual stress on SiNx deposition temperature is observed, with the magnitude of stress changing linearly from ~300 MPa tensile stress to ~600 MPa compressive stress as the deposition temperature is decreased from 300 to 100 °C. However, the results deviate from the linear dependence by a different degree for both measurement techniques at low deposition temperatures. The stress values obtained via the substrate curvature method deviate from the linear dependence for deposition temperatures below 200 °C, whereas the values obtained via the diagnostic microstructures method deviate from the linear dependence for deposition temperatures below 100 °C. Stress uniformity over the deposition area is also investigated.

https://iopscience.iop.org/article/10.1088/0964-1726/15/1/006/pdf

Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin films

Surface passivation has been recognized as a crucial step in the fabrication of mercury cadmium telluride photoconductive as well as photovoltaic detectors. The subject has attracted considerable attention in the past and several reviews existed by 1991. The subject matter, however, received added impetus with the development of techniques like MOCVD and MBE and recently there has been considerable work on MCT passivation using in situ grown II-VI semiconductors. In this report, we have tried to give the present status and identify the issues particularly with reference to the recent work on the subject.

Current status and issues in the surface passivation technology of mercury cadmium telluride infrared detectors

The effect of an abrupt CdTe∕HgCdTe passivation heterointerface on generation recombination and dark currents in n-on-p midwave infrared photodiodes with 5.2-μm cut-off wavelength has been investigated. Experimentally, it was observed that the zero-bias-dynamic resistance, R0, at low temperatures scales with the perimeter of the n-on-p junction, rather than with the junction area, suggesting that surface effects are dominant. The diode current–voltage characteristics at low temperatures indicate significant contributions from tunneling effects, which is the dominant leakage current mechanism for reverse bias greater than approximately 30mV. These two observations suggest that the region where the junction terminates at the CdTe∕HgCdTe abrupt interface is responsible for the above effects. A two-dimensional model has been developed to investigate the dark current mechanisms in the vicinity of the junction termination at CdTe∕HgCdTe interface, which also takes into account the effect of dislocations on generation-recombination processes. Calculated profiles of the energy bands and electric field along different cross sections of the photodiode indicate that the electric field achieves a maximum value of the order of mid −105V∕cm in the region where the junction terminates at the CdTe∕HgCdTe interface. The presence of such a high localized electric field in this area decreases the ionization energy of trap levels in the band gap and, hence, increases efficiency of the Shockley–Read–Hall generation-recombination processes. In addition to diffusion, generation recombination, and trap-assisted tunneling mechanisms, the calculations of dynamic resistance include Poole–Frenkel and phonon-trap-assisted tunneling effects. The best fit to the zero bias dynamic resistance versus temperature results has been obtained using an aerial dislocation density in the bulk of the HgCdTe layer equal to 106cm−2. Although the direct band-to-band tunneling and impact ionization processes were also considered, their contributions are shown to be insignificant.

Charles Musca

Papers

Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filters

HgCdTe mid-wavelength IR photovoltaic detectors fabricated using plasma induced junction technology

Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin films

Current status and issues in the surface passivation technology of mercury cadmium telluride infrared detectors

Generation-recombination effects on dark currents in CdTe-passivated midwave infrared HgCdTe photodiodes