C
Chen Fanyan
Researcher at Chinese Academy of Sciences
Publications - 16
Citations - 1014
Chen Fanyan is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Graphene & Spark plasma sintering. The author has an hindex of 10, co-authored 16 publications receiving 745 citations.
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Journal ArticleDOI
Effects of graphene content on the microstructure and properties of copper matrix composites
TL;DR: In this article, the impacts of graphene nanoplatelets on microstructure, mechanical performance, thermal diffusivity, electrical conductivity and tribological properties of the composites were investigated.
Journal ArticleDOI
Synthesis and Electrochemical Properties of Two-Dimensional Hafnium Carbide
Jie Zhou,Xian-Hu Zha,Xiaobing Zhou,Chen Fanyan,Guoliang Gao,Shuwei Wang,Cai Shen,Tao Chen,Chunyi Zhi,Per Eklund,Shiyu Du,Jianming Xue,Wei-Qun Shi,Zhifang Chai,Qing Huang +14 more
TL;DR: Hf3C2Tz MXenes with a 2D structure are candidate anode materials for metal-ion intercalation, especially for applications where size matter, and are determined to be flexible and conductive.
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Laser molecular beam epitaxy and characterization of perovskite oxide thin films
TL;DR: More than 10 kinds of perovskite oxide thin films and their heterostructures have been successfully fabricated on SrTiO3(STO) (0 0 1) substrates by laser molecular beam epitaxy (laser MBE).
Journal ArticleDOI
Effect of carbide interlayers on the microstructure and properties of graphene-nanoplatelet-reinforced copper matrix composites
Si Xiaoyang,Si Xiaoyang,Mian Li,Chen Fanyan,Per Eklund,Jianming Xue,Feng Huang,Shiyu Du,Qing Huang +8 more
TL;DR: Copper matrix composites reinforced with carbide-coated graphene nanoplatelets (GNP) were investigated in order to understand the role of the interlayers on the thermal, electrical, mechanical and....
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Thickness-dependent phase evolution and bonding strength of SiC ceramics joints with active Ti interlayer
Hui Yang,Hui Yang,Xiaobing Zhou,Xiaobing Zhou,Wen Shi,Ji Wang,Peng Li,Chen Fanyan,Qihuang Deng,Jaehyung Lee,Young-Hwan Han,Feng Huang,Liu He,Shiyu Du,Qing Huang +14 more
TL;DR: In this paper, a robust solid state diffusion joining technique for SiC ceramics was designed with a thickness-controlled Ti interlayer formed by physical vapor deposition and joined by electric field-assisted sintering technology.