C
Chin Chong Yap
Researcher at Nanyang Technological University
Publications - 18
Citations - 3532
Chin Chong Yap is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Flip chip & Carbon nanotube. The author has an hindex of 5, co-authored 18 publications receiving 2906 citations. Previous affiliations of Chin Chong Yap include Centre national de la recherche scientifique.
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From bulk to monolayer MoS2: evolution of Raman scattering
Hong Li,Qing Zhang,Chin Chong Yap,Beng Kang Tay,Teo Hang Tong Edwin,A. Olivier,Dominique Baillargeat +6 more
TL;DR: In this paper, it was shown that only the Raman frequencies of E 1 and A 1g peaks vary monotonously with the layer number of ultrathin Molybdenum disulfi de (MoS 2 ).
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Electrospinning: a facile technique for fabricating functional nanofibers for environmental applications
TL;DR: In this article, the authors give an overview on the latest research progress in the fabrication and utilization of functional polymer/ceramic/carbon nanofibers generated by electrospinning for air and water purification, as well as their applications as sensors for pollutant monitoring and control.
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Carbon nanotube bumps for the flip chip packaging system
Chin Chong Yap,Chin Chong Yap,Christophe Brun,Christophe Brun,Dunlin Tan,Dunlin Tan,Hong Li,Edwin Hang Tong Teo,Edwin Hang Tong Teo,Dominique Baillargeat,Beng Kang Tay,Beng Kang Tay +11 more
TL;DR: Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained in carbon nanotube interconnection bumps.
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Flip Chip Based on Carbon Nanotube–Carbon Nanotube Interconnected Bumps for High-Frequency Applications
Christophe Brun,Chin Chong Yap,Dunlin Tan,Stephane Bila,Sébastien Pacchini,Dominique Baillargeat,Beng Kang Tay +6 more
TL;DR: In this paper, a flip-chip structure based on carbon nanotube (CNT) interconnected bumps for high-frequency applications is presented, where the CNT bumps are grown directly on gold coplanar lines using the plasma-enhanced chemical vapor deposition approach, and interconnected using a flipchip bonder.
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Impact of the CNT growth process on gold metallization dedicated to RF interconnect applications
Chin Chong Yap,Dunlin Tan,Christophe Brun,Hong Li,Edwin Hang Tong Teo,Dominique Baillargeat,Beng Kang Tay +6 more
TL;DR: In this paper, the effect of carbon nanotubes growth on the underlying metallization, in particular gold, dedicated for radio-frequency-based applications, was examined specifically the effect on the adjacent components, and the results showed that it is promising to integrate CNTs grown using PECVD onto Au coplanar waveguide without degrading the S-parameters measurements up to 20 GHz.