D
Dierk Kaller
Researcher at IBM
Publications - 28
Citations - 155
Dierk Kaller is an academic researcher from IBM. The author has contributed to research in topics: Chip & Signal integrity. The author has an hindex of 7, co-authored 25 publications receiving 146 citations.
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Journal ArticleDOI
Signal Integrity Verification of Multichip Links Using Passive Channel Macromodels
A. Chinea,Stefano Grivet-Talocia,Haisheng Hu,Piero Triverio,Dierk Kaller,C. Siviero,M. Kindscher +6 more
TL;DR: In this article, a black-box time-domain macromodel is derived from tabulated frequency responses in scattering form, which is structured as a combination of ideal delay terms with frequency-dependent rational coefficients.
Journal ArticleDOI
First- and second-level packaging of the z990 processor cage
T.-M. Winkel,Wiren D. Becker,Hubert Harrer,H. Pross,Dierk Kaller,Bernd Garben,Bruce J. Chamberlin,S. A. Kuppinger +7 more
TL;DR: This paper describes the challenging first- and second-level packaging technology of a new system packaging architecture for the IBM eServerTM z990, which dramatically increases the volumetric processor density over that of the predecessor z900 by implementing a super-blade design comprising four node cards.
Journal ArticleDOI
Electronic packaging of the IBM z13 processor drawer
Wiren D. Becker,Hubert Harrer,Andreas Huber,William L. Brodsky,R. Krabbenhoft,Michael Cracraft,Dierk Kaller,Gregory R. Edlund,Thomas Strach +8 more
TL;DR: The electronic packaging of the IBM z13i is the foundation for a processor drawer that provides a significant increase in processing power relative to the IBMZEnterpriseA EC12 (zEC12) system while managing power and cost to meet the z13 product objectives.
Journal ArticleDOI
Evolution of organic chip packaging technology for high speed applications
Erich Klink,Bernd Garben,Andreas Huber,Dierk Kaller,Stefano Grivet-Talocia,George A. Katopis +5 more
TL;DR: The high dense interconnect (HDI) organic chip packaging technology has made rapid development advancements in the last few years and the recently introduced fine line core with micro vias, high signal input/output (I/O) applications and dense chip area array footprints can be supported.
Journal ArticleDOI
Electronic packaging of the IBM System z196 enterprise-class server processor cage
Thomas Strach,Frank E. Bosco,Kenneth L. Christian,K. R. Covi,Martin Eckert,G. R. Edlund,Roland Frech,Hubert Harrer,A. Huber,Dierk Kaller,M. Kindscher,A. Z. Muszynski,G. A. Peterson,C. Siviero,Jochen Supper,Otto Torreiter,T.-M. Winkel +16 more
TL;DR: This paper describes the first- and second-level system packaging structure of the IBM zEnterprise® 196 (z196) enterprise-class server, which required a more than 50% overall increase in system performance in comparison to its predecessor.