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Dieter P. Griffis

Researcher at North Carolina State University

Publications -  82
Citations -  1025

Dieter P. Griffis is an academic researcher from North Carolina State University. The author has contributed to research in topics: Secondary ion mass spectrometry & Focused ion beam. The author has an hindex of 16, co-authored 82 publications receiving 987 citations. Previous affiliations of Dieter P. Griffis include University of North Carolina at Chapel Hill.

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High field Q slope and the baking effect: Review of recent experimental results and new data on Nb heat treatments

TL;DR: In this paper, the performance of superconducting radio-frequency (SRF) cavities made of bulk Nb is characterized by exponentially increasing rf losses (high-field Q-slope), which are often mitigated by low temperature (100-140 °C, 12-48 h) baking.
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Chemical and spatial differentiation of syringyl and guaiacyl lignins in poplar wood via time-of-flight secondary ion mass spectrometry.

TL;DR: The spatial distribution of the syringyl (S) and guaiacyl (G) lignins, both over larger regions and within a single cell wall, on poplar ( Populus trichocarpa ) wood cross-sections was determined via time-of-flight secondary ion mass spectrometry (ToF-SIMS).
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H2O enhanced focused ion beam micromachining

TL;DR: The use of H2O vapor as a chemical adjunct for focused ion beam micromachining has been investigated in this article, where it was shown that H2V vapor can increase the removal rate of carbon-containing materials such as polyimide, PMMA, and other resists by a factor of 20 (relative to physical sputtering).
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Chemically and geometrically enhanced focused ion beam micromachining

TL;DR: In this paper, the authors investigated the effect of increasing the angle of the ion beam with respect to the sample surface normal on the material removal rate of focused ion beam (FIB) material removal.
PatentDOI

Chemically enhanced focused ion beam micro-machining of copper

TL;DR: In this article, a method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment.