Eduard Arzt

TL;DR: In this article, a polymeric Ga-containing liquid precursor was used for the first time to prepare a buffer layer for the growth of GaN by metalorganic chemical vapor deposition.

TL;DR: An atomic-level mechanism for this behavior is proposed here which is based on a kinetic analysis of diffusion in crystalline interfaces and predicts a reduction or reversal of the flux of host atoms for physically reasonable parameters and can account for the observed effect of copper on electromigration in aluminum conductor lines.

TL;DR: In this paper, the authors found that the Ta interlayer, which was expected to enhance Cu adhesion, led to significantly higher 500 °C stresses than did Ag. Interlayer stress was subtracted to calculate true Cu stresses.

TL;DR: In this paper, a micro-tensile tester built into a {theta-{theta} diffractometer was used to determine both elastic and plastic deformation in thin copper films.

TL;DR: Micropatterned and non-patterned compliant PDMS and PLGA did not show significant differences in adhesion on compliant mice ear skin or on gelatin-glycerin model substrates, but adhesion measurements for microp atterned stiff PLGA on compliant gelatin- glycerinmodel substrates showed significant enhancement in pull-off strengths compared to non- patterned controls.