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Goksen G. Yaralioglu

Researcher at Özyeğin University

Publications -  93
Citations -  4641

Goksen G. Yaralioglu is an academic researcher from Özyeğin University. The author has contributed to research in topics: Capacitive micromachined ultrasonic transducers & Ultrasonic sensor. The author has an hindex of 37, co-authored 92 publications receiving 4442 citations. Previous affiliations of Goksen G. Yaralioglu include InvenSense & Stanford University.

Papers
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Proceedings ArticleDOI

Reconfigurable arrays for portable ultrasound

TL;DR: Two central hypotheses are being tested: (1) the reconfigured array can acquire acoustic pulse-echo data in a manner equivalent or superior to today’s 1D piezoceramic arrays and (2) reconfigurable array technology will enable highly portable ultrasound platforms.
Patent

Microfluidic channels with integrated ultrasonic transducers for temperature measurement and method

TL;DR: In this article, an ultrasonic transducer transmits ultrasonic waves transmitted from one wall to the opposite wall, and a processor converts the time of flight to velocity by dividing the distance between walls by the time-of-flight.

Capacitive Micromachined Ultrasonic Lamb Wave Transducers Using Rectangular

TL;DR: This paper details the theory, fabrication, and characterization of a new Lamb wave device built using capacitive micromachined ultrasonic transducers using rectangular membranes to excite and receive Lamb waves on a silicon substrate.
Proceedings ArticleDOI

Improved equivalent circuit and finite element method modeling of capacitive micromachined ultrasonic transducers

TL;DR: In this paper, a 3D finite element model for one element of a 1D array with 7 hexagonal membranes in the width dimension was constructed, and it is assumed that the membranes are replicated in the length dimension infinitely by using symmetry boundary conditions.
Journal ArticleDOI

Characterization of a two-dimensional cantilever array with through-wafer electrical interconnects

TL;DR: In this paper, the characterization of two-dimensional micromachined silicon cantilever arrays with integrated through-wafer electrical interconnects is presented to address alignment and density issues associated with operating 2D scanning probe arrays.