H
Houman Zahedmanesh
Researcher at Katholieke Universiteit Leuven
Publications - 55
Citations - 868
Houman Zahedmanesh is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Electromigration & Computer science. The author has an hindex of 12, co-authored 45 publications receiving 632 citations. Previous affiliations of Houman Zahedmanesh include Sahand University of Technology & IMEC.
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Journal ArticleDOI
Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis
TL;DR: The hypothesis that arteries develop restenosis in response to injury, where high vessel stresses are a good measure of that injury, is supported.
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Simulation of a balloon expandable stent in a realistic coronary artery—Determination of the optimum modelling strategy
TL;DR: Direct application of pressure to the stent inner surface may be used as an optimal modelling strategy to estimate the stresses in the vessel wall using these restraining elements and hence offer a very efficient alternative approach to numerically modelling stent deployment within complex arterial geometries.
Journal ArticleDOI
Bacterial cellulose as a potential vascular graft: Mechanical characterization and constitutive model development.
Houman Zahedmanesh,Joseph N. Mackle,Anders Sellborn,Kristoffer Drotz,Aase Katarina Bodin,Paul Gatenholm,Caitríona Lally +6 more
TL;DR: The aim of this study was to mechanically characterize BC and also study its potential to accommodate vascular cells, whereby a constitutive model for BC was determined and used to model the BC tubes under inflation using finite element analysis.
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A multiscale mechanobiological modelling framework using agent-based models and finite element analysis: application to vascular tissue engineering.
TL;DR: A novel multiscale mechanobiological modelling framework is presented, which takes advantage of lattice-free agent-based models coupled with the finite element method to investigate the dynamics of VSMC growth in vascular tissue engineering scaffolds and their role in development of intimal hyperplasia.
Proceedings ArticleDOI
Interconnect metals beyond copper: reliability challenges and opportunities
Kristof Croes,Ch. Adelmann,Christopher J. Wilson,Houman Zahedmanesh,O. Varela Pedreira,C. Wu,A. Lesniewska,Herman Oprins,Sofie Beyne,Ivan Ciofi,D. Kocaay,Michele Stucchi,Zs. Tokei +12 more
TL;DR: In this paper, the reliability challenges of candidate metal systems to replace traditional Cu wiring in future interconnects are discussed and the main processing challenges are identified to be a) avoiding seam voids, b) adhesion, c) CMP and d) disruptive metal etch.